Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die

Patent metadata

Field	Value
Publication number	US-9379064-B2
Application number	US-201514697950-A
Country	US
Kind code	B2
Filing date	Apr 28, 2015
Priority date	Aug 14, 2009
Publication date	Jun 28, 2016
Grant date	Jun 28, 2016

Abstract

A semiconductor device is made by forming a heat spreader over a carrier. A semiconductor die is mounted over the heat spreader with a first surface oriented toward the heat spreader. A first insulating layer is formed over the semiconductor die and heat spreader. A via is formed in the first insulating layer. A first conductive layer is formed over the first insulating layer and connected to the heat spreader through the via and to contact pads on the semiconductor die. The heat spreader extends from the first surface of the semiconductor die to the via. A second insulating layer is formed over the first conductive layer. A second conductive layer is electrically connected to the first conductive layer. The carrier is removed. The heat spreader dissipates heat from the semiconductor die and provides shielding from inter-device interference. The heat spreader is grounded through the first conductive layer.

First claim

What is claimed:

1. A method of making a semiconductor device, comprising:
providing a shielding layer;
forming an interface layer over the shielding layer;
disposing a semiconductor die over the interface layer;
forming a first insulating layer over the shielding layer;
forming a via through a surface of the first insulating layer and extending through the first insulating layer to the shielding layer; and
forming a first conductive layer over the surface of the first insulating layer and into the via to the shielding layer.

2. The method of claim 1 , further including forming a second insulating layer over the first insulating layer and semiconductor die.

3. The method of claim 2 , further including forming a second conductive layer over the second insulating layer.

4. The method of claim 3 , further including forming an interconnect structure over the second conductive layer.

5. The method of claim 1 , wherein the shielding layer provides shielding with respect to electromagnetic interference (EMI).

6. The method of claim 1 , further including:
providing a carrier; and
disposing the shielding layer between the semiconductor die and carrier.

7. A method of making a semiconductor device, comprising:
providing a shielding layer;
disposing a semiconductor die over the shielding layer with a non-active surface of the semiconductor die oriented toward the shielding layer;
forming a first insulating layer over the shielding layer; and
forming a conductive via through the first insulating layer and extending to the shielding layer.

8. The method of claim 7 , further including forming a second insulating layer over the first insulating layer and semiconductor die.

9. The method of claim 8 , further including forming a conductive layer over the second insulating layer.

10. The method of claim 9 , further including forming an interconnect structure over the conductive layer.

11. The method of claim 7 , further including disposing an interface layer between the semiconductor die and shielding layer.

12. The method of claim 7 , further including:
providing a carrier; and
disposing the shielding layer between the semiconductor die and carrier.

13. The method of claim 7 , wherein the shielding layer extends continuously across the semiconductor die.

14. A semiconductor device, comprising:
a shielding layer;
a semiconductor die disposed over the shielding layer with a non-active surface of the semiconductor die oriented toward the shielding layer;
a first insulating layer formed over the shielding layer; and
a first conductive layer formed over a surface of the first insulating layer and extending through the first insulating layer to the shielding layer.

15. The semiconductor device of claim 14 , further including a second insulating layer formed over the first insulating layer and semiconductor die.

16. The semiconductor device of claim 15 , further including a second conductive layer formed over the second insulating layer.

17. The semiconductor device of claim 16 , further including an interconnect structure formed over the second conductive layer.

18. The semiconductor device of claim 14 , further including an interface layer disposed between the semiconductor die and shielding layer.

19. The semiconductor device of claim 14 , wherein the shielding layer extends continuously across the semiconductor die.

20. A semiconductor device, comprising:
a shielding layer;
an interface layer formed over the shielding layer;
a semiconductor die disposed over the interface layer;
a first insulating layer formed over the shielding layer; and
a conductive via formed through the first insulating layer and extending to the shielding layer.

21. The semiconductor device of claim 20 , further including a second insulating layer formed over the first insulating layer and semiconductor die.

22. The semiconductor device of claim 21 , further including a conductive layer over the second insulating layer.

23. The semiconductor device of claim 22 , further including an interconnect structure formed over the conductive layer.

24. The semiconductor device of claim 20 , wherein the shielding layer provides shielding with respect to electromagnetic interference (EMI).

25. The semiconductor device of claim 20 , wherein the shielding layer extends continuously across the semiconductor die.

Assignees

• Stats Chippac Ltd
• Stats Chippac Pte Ltd

Inventors

• Oh Jihoon
• Lee Sinjae
• Kim Jingwan

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/9413

  on encapsulations · CPC title