Carbon dioxide absorbent comprising ionic liquid and alcohol solvent, and method of separating carbon dioxide using the same
US-12508572-B2 · Dec 30, 2025 · US
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Lee Junga patents
Lee Junga is listed as an inventor on 24 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Junga |
| Total patents | 24 |
| First publication | Jan 28, 2021 |
| Latest publication | Dec 30, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor packages having fixing members
US-12494439-B2 · Dec 9, 2025 · US
Epitaxial wafer and semiconductor memory device using the same
US-12382672-B2 · Aug 5, 2025 · US
Solder reflow apparatus and method of manufacturing an electronic device
US-2025167166-A1 · May 22, 2025 · US
Carbon Dioxide Absorbent Comprising Ionic Liquid and Alcohol Solvent, and Method Of Separating Carbon Dioxide Using the Same
US-2025153143-A1 · May 15, 2025 · US
Method for manufacturing semiconductor devices
US-2025132203-A1 · Apr 24, 2025 · US
Carbon dioxide absorbent including phenolate-based ionic liquid and aliphatic alcohol and method of separating carbon dioxide using the same
US-12257566-B2 · Mar 25, 2025 · US
Solder reflow apparatus and method of manufacturing an electronic device
US-12237297-B2 · Feb 25, 2025 · US
Semiconductor package having package substrate
US-12205925-B2 · Jan 21, 2025 · US
Semiconductor package
US-2025022866-A1 · Jan 16, 2025 · US
Recent patents
Latest publications not already listed above.
Carbon Dioxide Absorbent Including Phenolate-Based Ionic Liquid and Aliphatic Alcohol and Method of Separating Carbon Dioxide Using the Same
US-2025001390-A1 · Jan 2, 2025 · US
Cover window, manufacturing method of the cover window and display device including the cover window
US-2024224730-A1 · Jul 4, 2024 · US
Semiconductor package manufacturing method and a bonding device for manufacturing a semiconductor package
US-2024170448-A1 · May 23, 2024 · US
Window, display device including the window, and manufacturing method thereof
US-2024118460-A1 · Apr 11, 2024 · US
Solder reflow apparatus and method of manufacturing an electronic device
US-2024047411-A1 · Feb 8, 2024 · US
Carbon Dioxide Absorbent Comprising Ionic Liquid and Alcohol Solvent, and Method Of Separating Carbon Dioxide Using the Same
US-2023405555-A1 · Dec 21, 2023 · US
Interposers and semiconductor packages including the same
US-11742294-B2 · Aug 29, 2023 · US
Semiconductor packages having fixing members
US-2023260926-A1 · Aug 17, 2023 · US
Epitaxial wafer and semiconductor memory device using the same
US-2023141135-A1 · May 11, 2023 · US
Semiconductor package having package substrate
US-2022367416-A1 · Nov 17, 2022 · US
Pad printing device
US-11358382-B2 · Jun 14, 2022 · US
Interposers and semiconductor packages including the same
US-2022093519-A1 · Mar 24, 2022 · US
Remote service diagnostics and service scheduling for appliances
US-2021111918-A1 · Apr 15, 2021 · US
Pad printing device
US-2021023835-A1 · Jan 28, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 14 |
| Sk Innovation Co Ltd | 5 |
| Samsung Display Co Ltd | 4 |
| Haier Us Appliance Solutions Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 8 |
| H10W90/00 | 8 |
| H10W72/072 | 8 |
| H01L24/16 | 8 |
| H10W90/291 | 7 |