Wafer level ultrasonic chip module and manufacturing method thereof
US-11590536-B2 · Feb 28, 2023 · US
Lee Hung-Ping is listed as an inventor on 11 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Hung-Ping |
| Total patents | 11 |
| First publication | Jan 11, 2018 |
| Latest publication | Feb 28, 2023 |
Publications ranked by popularity score, then publication date.
US-11590536-B2 · Feb 28, 2023 · US
US-2023014827-A1 · Jan 19, 2023 · US
US-11478822-B2 · Oct 25, 2022 · US
US-11460341-B2 · Oct 4, 2022 · US
US-11075072-B2 · Jul 27, 2021 · US
US-2021013026-A1 · Jan 14, 2021 · US
US-2020191646-A1 · Jun 18, 2020 · US
US-2020179979-A1 · Jun 11, 2020 · US
US-2020164406-A1 · May 28, 2020 · US
US-10120634-B2 · Nov 6, 2018 · US
Latest publications not already listed above.
US-2018011677-A1 · Jan 11, 2018 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| J Metrics Tech Co Ltd | 8 |
| Univ Peking Shenzhen Graduate School | 6 |
| Univ Peking Shenzhen Graduate School | 3 |
| Anpec Electronics Corp | 2 |
| Sonicmems Zhengzhou Tech Co Ltd | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06V40/1306 | 9 |
| H10N30/302 | 7 |
| H10N30/02 | 7 |
| H10N30/03 | 5 |
| B06B1/0662 | 5 |