Integrated package structure for mems element and asic chip and method for manufacturing the same
US-2020262700-A1 · Aug 20, 2020 · US
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Univ Peking Shenzhen Graduate School patents
Univ Peking Shenzhen Graduate School holds 4 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 4 |
| Recent patents | 0 |
| First publication | May 28, 2020 |
| Latest publication | Aug 20, 2020 |
Filing trend
Year-over-year patent counts for this assignee.
Not enough yearly data to assess filing trend yet.
| Year | Patents |
|---|---|
| 2020 | 4 |
| Year | Patents |
|---|---|
| 2020 | 4 |
Recent patents
Latest publications where this party is an assignee.
Wafer scale ultrasonic sensor assembly and method for manufacturing the same
US-2020191646-A1 · Jun 18, 2020 · US
Wafer level ultrasonic chip module and manufacturing method thereof
US-2020179979-A1 · Jun 11, 2020 · US
Wafer level ultrasonic chip module having suspension structure and manufacturing method thereof
US-2020164406-A1 · May 28, 2020 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Integrated package structure for mems element and asic chip and method for manufacturing the same
US-2020262700-A1 · Aug 20, 2020 · US
Wafer scale ultrasonic sensor assembly and method for manufacturing the same
US-2020191646-A1 · Jun 18, 2020 · US
Wafer level ultrasonic chip module and manufacturing method thereof
US-2020179979-A1 · Jun 11, 2020 · US
Wafer level ultrasonic chip module having suspension structure and manufacturing method thereof
US-2020164406-A1 · May 28, 2020 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Operations & Transport | 4 |
| Physics | 3 |
| Electricity | 3 |
| Cross-Sectional Technologies | 1 |