Semiconductor packages including recesses to contain solder
US-12062589-B2 · Aug 13, 2024 · US
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Ledutke Michael patents
Ledutke Michael is listed as an inventor on 15 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ledutke Michael |
| Total patents | 15 |
| First publication | Dec 1, 2015 |
| Latest publication | Aug 13, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor packages including recesses to contain solder
US-2022415745-A1 · Dec 29, 2022 · US
Semiconductor module with shaped external contact for reduced crack formation in the encapsulation body
US-2022415732-A1 · Dec 29, 2022 · US
Semiconductor module
US-11040872-B2 · Jun 22, 2021 · US
Methods for producing packaged semiconductor devices
US-10923364-B2 · Feb 16, 2021 · US
Method for producing a semiconductor module
US-2020039820-A1 · Feb 6, 2020 · US
Method for producing a semiconductor module
US-10435292-B2 · Oct 8, 2019 · US
Method for manufacturing an arrangement including a chip carrier notch
US-10361138-B2 · Jul 23, 2019 · US
Methods for producing packaged semiconductor devices
US-2019074198-A1 · Mar 7, 2019 · US
Package with vertically spaced partially encapsulated contact structures
US-10128165-B2 · Nov 13, 2018 · US
Recent patents
Latest publications not already listed above.
Package with vertically spaced partially encapsulated contact structures
US-2018122720-A1 · May 3, 2018 · US
Method for producing a semiconductor module
US-2018022601-A1 · Jan 25, 2018 · US
Arrangement having a plurality of chips and a chip carrier, and a processing arrangement
US-2017263480-A1 · Sep 14, 2017 · US
Arrangement having a plurality of chips and a chip carrier, and a processing arrangement
US-9698070-B2 · Jul 4, 2017 · US
Semiconductor devices and methods of producing these
US-9202753-B2 · Dec 1, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 15 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/114 | 7 |
| H10W74/111 | 6 |
| H10W74/014 | 6 |
| H01L21/561 | 6 |
| H01L23/3121 | 6 |