Drift tracking feedback for communication channels
US-11669124-B2 · Jun 6, 2023 · US
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Lambrecht Frank patents
Lambrecht Frank is listed as an inventor on 49 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lambrecht Frank |
| Total patents | 49 |
| First publication | Mar 17, 2015 |
| Latest publication | Jun 6, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Drift tracking feedback for communication channels
US-2022300030-A1 · Sep 22, 2022 · US
Drift tracking feedback for communication channels
US-11327524-B2 · May 10, 2022 · US
Methods and apparatus for synchronizing communication with a memory controller
US-2021027826-A1 · Jan 28, 2021 · US
Drift tracking feedback for communication channels
US-2020209911-A1 · Jul 2, 2020 · US
Methods and apparatus for synchronizing communication with a memory controller
US-10699769-B2 · Jun 30, 2020 · US
Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows
US-10692842-B2 · Jun 23, 2020 · US
Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows
US-10643977-B2 · May 5, 2020 · US
Drift tracking feedback for communication channels
US-10503201-B2 · Dec 10, 2019 · US
Methods and apparatus for synchronizing communication with a memory controller
US-2019198085-A1 · Jun 27, 2019 · US
Recent patents
Latest publications not already listed above.
Microelectronic Package Including Microelectronic Elements Having Stub Minimization For Wirebond Assemblies Without Windows
US-2019035769-A1 · Jan 31, 2019 · US
Methods and apparatus for synchronizing communication with a memory controller
US-10192610-B2 · Jan 29, 2019 · US
Microelectronic Package Having Stub Minimization Using Symmetrically-Positioned Duplicate Sets of Terminals for Wirebond Assemblies Without Windows
US-2018331074-A1 · Nov 15, 2018 · US
Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows
US-10090280-B2 · Oct 2, 2018 · US
Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows
US-10032752-B2 · Jul 24, 2018 · US
Methods and apparatus for synchronizing communication with a memory controller
US-2018047437-A1 · Feb 15, 2018 · US
Drift tracking feedback for communication channels
US-2017344050-A1 · Nov 30, 2017 · US
Stub minimization for wirebond assemblies without windows
US-2017256519-A1 · Sep 7, 2017 · US
Methods and apparatus for synchronizing communication with a memory controller
US-9741423-B2 · Aug 22, 2017 · US
Drift tracking feedback for communication channels
US-9710011-B2 · Jul 18, 2017 · US
Stub minimization for assemblies without wirebonds to package substrate
US-9679838-B2 · Jun 13, 2017 · US
Microelectronic package having at least two microelectronic elements that are horizontally spaced apart from each other
US-9679876-B2 · Jun 13, 2017 · US
Methods and apparatus for synchronizing communication with a memory controller
US-2017154665-A1 · Jun 1, 2017 · US
Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
US-2017084584-A1 · Mar 23, 2017 · US
Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
US-2017062389-A1 · Mar 2, 2017 · US
Stub minimization using duplicate sets of signal terminals
US-9530458-B2 · Dec 27, 2016 · US
Microelectronic packaging without wirebonds to package substrate having terminals with signal assignments that mirror each other with respect to a central axis
US-9515053-B2 · Dec 6, 2016 · US
Microelectronic assembly with opposing microelectronic packages each having terminals with signal assignments that mirror each other with respect to a central axis
US-9496243-B2 · Nov 15, 2016 · US
Methods and apparatus for synchronizing communication with a memory controller
US-9466353-B2 · Oct 11, 2016 · US
Stub minimization for wirebond assemblies without windows
US-2016276316-A1 · Sep 22, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Invensas Corp | 27 |
| Rambus Inc | 19 |
| Tessera Inc | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/754 | 30 |
| H10W90/734 | 30 |
| H10W90/732 | 30 |
| H10W90/24 | 30 |
| H10W90/00 | 30 |