Microelectronic packaging without wirebonds to package substrate having terminals with signal assignments that mirror each other with respect to a central axis

Patent metadata

Field	Value
Publication number	US-9515053-B2
Application number	US-201615060240-A
Country	US
Kind code	B2
Filing date	Mar 3, 2016
Priority date	Oct 3, 2011
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

A microelectronic assembly can include a circuit panel having first and second panel contacts at respective first and second surfaces thereof, and first and second microelectronic packages each having terminals mounted to the respective panel contacts. Each package can include a microelectronic element having a face and contacts thereon, a substrate having first and second surfaces, and terminals on the second surface configured for connecting the package with an external component. The terminals can include first terminals at positions within first and second parallel grids. The first terminals can be configured to carry address information usable by circuitry within the package to determine an addressable memory location from among all the available addressable memory locations of a memory storage array within the microelectronic element. Signal assignments of the first terminals in the first grid can be a mirror image of signal assignments of the first terminals in the second grid.

First claim

The invention claimed is:

1. A microelectronic package, comprising:
a microelectronic element having a face and clement contacts exposed at the face, the microelectronic element having memory storage array function;
a substrate having first and second opposed surfaces, the substrate having a set of substrate contacts exposed at the first surface facing the element contacts of the microelectronic element and joined to the element contacts; and
terminals exposed at the second surface configured for connecting the microelectronic package with at least one component external to the package, the terminals electrically connected with the substrate contacts and including first terminals, the first terminals including a first set disposed on a first side of a theoretical axis and a second set disposed on a second side of the theoretical axis opposite from the first side, each of the first and second sets being configured to carry address information,
the terminals including second terminals, the second terminals including a third set disposed on the first side of the theoretical axis and a fourth set disposed on the second side of the theoretical axis, each of the third and fourth sets being configured to carry second information, the second information being other than the information carried by the first terminals, the second information including data signals, wherein the first and second sets separate the third and fourth sets from one another,
wherein the signal assignments of the first terminals in the first set are a mirror image of the signal assignments of the first terminals in the second set.

2. The microelectronic package as claimed in claim 1 , wherein the microelectronic element embodies a greater number of active devices to provide memory storage array function than any other function.

3. The microelectronic package as claimed in claim 1 , wherein the first terminals of each of the first and second sets are configured to carry all of the address information usable by the circuitry within the microelectronic package to determine the addressable memory location.

4. The microelectronic package as claimed in claim 1 , wherein the first terminals of each of the first and second sets are configured to carry information that controls an operating mode of the microelectronic element.

5. The microelectronic package as claimed in claim 4 , wherein the first terminals of each of the first and second sets are configured to carry all of the command signals transferred to the microelectronic package, the command signals being write enable, row address strobe, and column address strobe signals.

6. The microelectronic package as claimed in claim 1 , wherein the first terminals of each of the first and second sets are configured to carry clock signals transferred to the microelectronic package, the clock signals being clocks used for sampling signals carrying the address information.

7. The microelectronic package as claimed in claim 1 , wherein the first terminals of each of the first and second sets are configured to carry all of the bank address signals transferred to the microelectronic package.

8. The microelectronic package as claimed in claim 1 , wherein the element contacts include redistribution contacts exposed at the front face of the microelectronic element, each redistribution contact being electrically connected with a contact pad of the microelectronic element through at least one of a trace or a via.

9. The microelectronic package as claimed in claim 1 , further comprising a buffer chip having a surface facing the first surface of the substrate, the buffer chip being electrically connected with the first terminals of at least one of the first and second sets, the buffer chip being configured to regenerate at least some of the address information received at the first terminals and output the regenerated address information to the microelectronic element.

10. A microelectronic assembly, comprising:
a circuit panel having first and second opposed surfaces and first and second panel contacts exposed at the first and second surfaces, respectively; and
first and second microelectronic packages each having terminals mounted to the respective panel contacts,
each microelectronic package including:
a microelectronic element having a face and element contacts exposed at the face, the microelectronic element having memory storage array function;
a substrate having first and second opposed surfaces, the substrate having a set of substrate contacts exposed at the first surface facing the element contacts of the microelectronic element and joined to the element contacts; and
terminals exposed at the second surface of the substrate configured for connecting the microelectronic package with at least one component external to the package, the terminals electrically connected with the substrate contacts and including first terminals, the first terminals including a first set disposed on a first side of a theoretical axis and a second set disposed on a second side of the theoretical axis opposite from the first side, each of the first and second sets being configured to carry address information,
the terminals including second terminals, the second terminals including a third set disposed on the first side of the theoretical axis and a fourth set disposed on the second side of the theoretical axis, each of the third and fourth sets being configured to carry second information, the second information being other than the information carried by the first terminals, the second information including data signals, wherein the first and second sets separate the third and fourth sets from one another,
wherein the signal assignments of the first terminals in the first set are a mirror image of the signal assignments of the first terminals in the second set.

11. The microelectronic assembly as claimed in claim 10 , wherein the microelectronic element of each microelectronic package embodies a greater number of active devices to provide memory storage array function than any other function.

12. The microelectronic assembly as claimed in claim 10 , wherein the first terminals of each of the first and second sets of each microelectronic package are configured to carry all of the address information usable by the circuitry within the respective microelectronic package to determine the addressable memory location.

13. The microelectronic assembly as claimed in claim 10 , wherein the first terminals of each of the first and second sets of each microelectronic package are configured to carry information that controls an operating mode of the microelectronic element of the respective microelectronic package.

14. The microelectronic assembly as claimed in claim 13 , wherein the first terminals of each of the first and second sets of each microelectronic package are configured to carry all of the command signals transferred to the respective microelectronic package, the command signals being write enable, row address strobe, and column address strobe signals.

15. The microelectronic assembly as claimed in claim 10 , wherein the first terminals of each of the first and second sets of each microelectronic package are configured to carry clock signals transferred to the respective microelectronic package, the clock signals being clocks used for sampling signals carrying the address information.

16. The microelectronic assembly as claimed in claim 10 , wherein the first terminals of each of the first and second sets of each microelectronic package are configured to carry all of the bank address signals transferred to the respective

Assignees

• Invensas Corp

Inventors

• Crisp Richard Dewitt
• Zohni Wael
• Haba Belgacem
• Lambrecht Frank

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/752

  between stacked chips · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title