Semiconductor component having through-silicon vias
US-11545392-B2 · Jan 3, 2023 · US
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Kuo Darryl patents
Kuo Darryl is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kuo Darryl |
| Total patents | 7 |
| First publication | Aug 16, 2016 |
| Latest publication | Jan 3, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor component having through-silicon vias
US-2021005515-A1 · Jan 7, 2021 · US
Method of making a semiconductor component having through-silicon vias
US-10784162-B2 · Sep 22, 2020 · US
Method of making a semiconductor component having through-silicon vias
US-2019067107-A1 · Feb 28, 2019 · US
Semiconductor component having through-silicon vias and method of manufacture
US-10115634-B2 · Oct 30, 2018 · US
Semiconductor component having through-silicon vias and method of manufacture
US-2016329245-A1 · Nov 10, 2016 · US
Semiconductor component having through-silicon vias and method of manufacture
US-9418923-B2 · Aug 16, 2016 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 7 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/0265 | 7 |
| H10W20/0245 | 7 |
| H10P95/062 | 7 |
| H10P52/403 | 7 |
| H10P52/402 | 7 |