Plasma-enhanced chemical vapor deposition method
US-2026085425-A1 · Mar 26, 2026 · US
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Koty Devi patents
Koty Devi is listed as an inventor on 11 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Koty Devi |
| Total patents | 11 |
| First publication | Jun 25, 2020 |
| Latest publication | Mar 26, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Selective etching of top electrode metal to phase-change material by tuning wafer temperature
US-2026007079-A1 · Jan 1, 2026 · US
Pillar critical dimension reduction by isotropic plasma etching with high selectivity to silicon-containing antireflective coating and silicon nitride
US-2025287608-A1 · Sep 11, 2025 · US
Halogen gas mixtures for through-substrate etching
US-2025279281-A1 · Sep 4, 2025 · US
Methods for etching metal films using plasma processing
US-12057322-B2 · Aug 6, 2024 · US
Plasma co-doping to reduce the forming voltage in resistive random access memory (ReRAM) devices
US-11844290-B2 · Dec 12, 2023 · US
Resistive memory device and method of forming
US-2023329127-A1 · Oct 12, 2023 · US
Plasma Co-Doping To Reduce The Forming Voltage In Resistive Random Access Memory (ReRAM) Devices
US-2022393107-A1 · Dec 8, 2022 · US
Oxygen-free plasma etching for contact etching of resistive random access memory
US-11258012-B2 · Feb 22, 2022 · US
Methods for etching metal films using plasma processing
US-2021118693-A1 · Apr 22, 2021 · US
Recent patents
Latest publications not already listed above.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Tokyo Electron Ltd | 11 |
| IBM | 10 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10N70/063 | 7 |
| H10N70/826 | 6 |
| H10N70/841 | 5 |
| H10N70/8833 | 5 |
| H10N70/24 | 5 |