High-speed dynamic beam shaping
US-12204228-B2 · Jan 21, 2025 · US
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Kotler Zvi patents
Kotler Zvi is listed as an inventor on 44 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kotler Zvi |
| Total patents | 44 |
| First publication | Feb 5, 2015 |
| Latest publication | Jan 21, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Lift printing using thin donor foils
US-12162294-B2 · Dec 10, 2024 · US
Hybrid, multi-material 3D printing
US-12042984-B2 · Jul 23, 2024 · US
Repair of solder bumps
US-2024222302-A1 · Jul 4, 2024 · US
Electrical interconnection of circuit elements on a substrate without prior patterning
US-11881466-B2 · Jan 23, 2024 · US
Lift Printing of Fine Metal Lines
US-2023422402-A1 · Dec 28, 2023 · US
High-resolution soldering
US-11627667-B2 · Apr 11, 2023 · US
Laser Printing of Solder Pastes
US-2022347778-A1 · Nov 3, 2022 · US
System producing a conductive path on a substrate
US-11464114-B2 · Oct 4, 2022 · US
Acousto-optic deflector with multiple output beams
US-11409184-B2 · Aug 9, 2022 · US
Recent patents
Latest publications not already listed above.
High-resolution soldering
US-2022248540-A1 · Aug 4, 2022 · US
High-Speed Dynamic Beam Shaping
US-2022121082-A1 · Apr 21, 2022 · US
LIFT printing of conductive traces onto a semiconductor substrate
US-11271119-B2 · Mar 8, 2022 · US
Lift Printing Using Thin Donor Foils
US-2022024223-A1 · Jan 27, 2022 · US
System Producing a Conductive Path on a Substrate
US-2021195756-A1 · Jun 24, 2021 · US
Methods and Systems for Producing Three-Dimensional Electronic Products
US-2021157238-A1 · May 27, 2021 · US
Electrical Interconnection Of Circuit Elements On A Substrate Without Prior Patterning
US-2021028141-A1 · Jan 28, 2021 · US
Control of surface properties of printed three-dimensional structures
US-10688692-B2 · Jun 23, 2020 · US
Printing of three-dimensional metal structures with a sacrificial support
US-10633758-B2 · Apr 28, 2020 · US
Lift printing of multi-composition material structures
US-10629442-B2 · Apr 21, 2020 · US
Pulsed-mode direct-write laser metallization
US-10622244-B2 · Apr 14, 2020 · US
Method producing a conductive path on a substrate
US-2020093001-A1 · Mar 19, 2020 · US
Method producing a conductive path on a substrate
US-10537027-B2 · Jan 14, 2020 · US
Acousto-optic deflector with multiple output beams
US-2019369459-A1 · Dec 5, 2019 · US
Control of lift ejection angle
US-10471538-B2 · Nov 12, 2019 · US
Acousto-optic deflector with multiple output beams
US-10451953-B2 · Oct 22, 2019 · US
Hybrid, multi-material 3D printing
US-2019263054-A1 · Aug 29, 2019 · US
LIFT printing of conductive traces onto a semiconductor substrate
US-2019088804-A1 · Mar 21, 2019 · US
LIFT printing of conductive traces onto a semiconductor substrate
US-10193004-B2 · Jan 29, 2019 · US
Control of Surface Properties of Printed Three-Dimensional Structures
US-2018281243-A1 · Oct 4, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Orbotech Ltd | 44 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K2203/107 | 18 |
| C23C14/28 | 14 |
| C23C14/048 | 10 |
| H05K1/097 | 9 |
| H05K2203/108 | 9 |