System producing a conductive path on a substrate

Patent metadata

Field	Value
Publication number	US-11464114-B2
Application number	US-202117174337-A
Country	US
Kind code	B2
Filing date	Feb 11, 2021
Priority date	Aug 2, 2013
Publication date	Oct 4, 2022
Grant date	Oct 4, 2022

Abstract

A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.

First claim

The invention claimed is:

1. A system for producing a conductive path on a substrate comprising:
an optical assembly including:
a patterning laser, operative to generate a patterning laser beam; and
an ablating laser, operative to generate an ablating laser beam; and

a substrate positioning assembly, movable relative to said optical assembly, operative to position said optical assembly relative to a substrate,
a camera in electronic communication with a workstation, wherein said workstation is configured to:
identify a cut between two ends of said conductive path,
send instructions to deposit a layer of material such that said layer of material is in contact with said two ends of said conductive path, and
send instructions to selectably sinter regions of said layer of material thereby causing said metal particles to together define a conductor at sintered regions between said two ends of said conductive path,

said patterning laser beam being operative to selectably sinter regions of said layer of material having a thickness in a range of 0.1 to 5 microns, including metal particles having a diameter in a range of 10 to 100 nanometers, deposited on said substrate, thereby causing said metal particles to together define a conductor at sintered regions; and
said ablating laser beam, being operative to deposit said layer of material and, below a threshold at which said sintered regions would be ablated, to ablate portions of said layer of material other than at said sintered regions.

2. The system for producing a conductive path on a substrate according to claim 1 , wherein said substrate positioning assembly is moveable in both x and y directions relative to said optical assembly.

3. The system for producing a conductive path on a substrate according to claim 1 , wherein said patterning laser is a continuous wave laser.

4. The system for producing a conductive path on a substrate according to claim 1 , wherein said ablating laser is a pulsed laser.

5. The system for producing a conductive path on a substrate according to claim 1 , further comprising a blower.

6. The system for producing a conductive path on a substrate according to claim 1 , wherein said layer of material comprises conductive ink.

7. The system for producing a conductive path on a substrate according to claim 1 , wherein said patterning laser beam is a continuous laser beam and has a power level between 40-100 mW.

8. The system for producing a conductive path on a substrate according to claim 1 , wherein said workstation is configured to send instructions to:
define at least two areas on said substrate forming part of said conductive path; and
employ said ablating laser beam to ablate portions of a non-conductive layer formed over said substrate in said at least two areas.

9. The system for producing a conductive path on a substrate according to claim 6 , wherein said layer of material is a nanoparticle silver ink, a nanoparticle copper ink, or a non-metal conductive ink.

Assignees

• Orbotech Ltd

Inventors

• Kotler Zvi
• Zenou Michael

Classifications

• Y10T29/49156

  with selective destruction of conductive paths · CPC title

• H05K3/027 Primary

  the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles · CPC title

• H05K3/225

  Correcting or repairing of printed circuits (H05K1/0292, H05K3/222, H05K3/288, H05K3/4685 take precedence) · CPC title

• H05K3/1241

  by ink-jet printing or drawing by dispensing · CPC title

• H05K2201/026

  Nanotubes or nanowires · CPC title