Semiconductor package and semiconductor package manufacturing method
US-2024321700-A1 · Sep 26, 2024 · US
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Ko Taeho patents
Ko Taeho is listed as an inventor on 9 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ko Taeho |
| Total patents | 9 |
| First publication | Jul 1, 2021 |
| Latest publication | Sep 26, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor packages
US-11735532-B2 · Aug 22, 2023 · US
Semiconductor devices including thick pad
US-11652076-B2 · May 16, 2023 · US
Semiconductor packages
US-2022278049-A1 · Sep 1, 2022 · US
Semiconductor devices including thick pad
US-2022262757-A1 · Aug 18, 2022 · US
Semiconductor devices including thick pad
US-11355467-B2 · Jun 7, 2022 · US
Semiconductor packages
US-11355445-B2 · Jun 7, 2022 · US
Semiconductor devices including thick pad
US-2021217720-A1 · Jul 15, 2021 · US
Semiconductor packages
US-2021202397-A1 · Jul 1, 2021 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 9 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/60 | 9 |
| H10W70/09 | 9 |
| H10W90/00 | 9 |
| H10W70/614 | 9 |
| H10W90/701 | 9 |