Method of manufacturing semiconductor device
US-2026047355-A1 · Feb 12, 2026 · US
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Kimura Yasuhiro patents
Kimura Yasuhiro is listed as an inventor on 18 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kimura Yasuhiro |
| Total patents | 18 |
| First publication | Feb 7, 2017 |
| Latest publication | Feb 12, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor manufacturing apparatus
US-2024387201-A1 · Nov 21, 2024 · US
Semiconductor inspection apparatus, method of inspecting semiconductor wafer, and method of manufacturing semiconductor device
US-2024353351-A1 · Oct 24, 2024 · US
SiC epitaxial wafer and manufacturing method of the same
US-10964785-B2 · Mar 30, 2021 · US
SiC epitaxial wafer, method for manufacturing SiC epitaxial wafer, SiC device, and power conversion apparatus
US-10950435-B2 · Mar 16, 2021 · US
Silicon carbide epitaxial substrate and silicon carbide semiconductor device
US-10858757-B2 · Dec 8, 2020 · US
Vacuum pump having a first housing with a supply port and a second housing with a recess portion
US-10837447-B2 · Nov 17, 2020 · US
Vacuum pump and control method therefor
US-2020271120-A1 · Aug 27, 2020 · US
Vacuum pump
US-2020240412-A1 · Jul 30, 2020 · US
Semiconductor wafer, semiconductor device, and method for producing semiconductor device
US-10707075-B2 · Jul 7, 2020 · US
Recent patents
Latest publications not already listed above.
Semiconductor wafer, semiconductor device, and method for producing semiconductor device
US-2020144053-A1 · May 7, 2020 · US
SiC EPITAXIAL WAFER AND MANUFACTURING METHOD OF THE SAME
US-2020066847-A1 · Feb 27, 2020 · US
Method for manufacturing SiC substrate
US-10559508-B2 · Feb 11, 2020 · US
Sic epitaxial wafer, method for manufacturing sic epitaxial wafer, sic device, and power conversion apparatus
US-2020020528-A1 · Jan 16, 2020 · US
METHOD FOR MANUFACTURING SiC SUBSTRATE
US-2019355629-A1 · Nov 21, 2019 · US
Silicon carbide epitaxial substrate and silicon carbide semiconductor device
US-2019145021-A1 · May 16, 2019 · US
Manufacturing method and apparatus for manufacturing silicon carbide epitaxial wafer
US-2017040166-A1 · Feb 9, 2017 · US
Manufacturing method and apparatus for manufacturing silicon carbide epitaxial wafer
US-9564315-B1 · Feb 7, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Mitsubishi Electric Corp | 15 |
| Ulvac Inc | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P14/2904 | 13 |
| H10D62/8325 | 11 |
| C30B29/36 | 11 |
| H10P14/3408 | 10 |
| H10P14/24 | 10 |