Semiconductor package and manufacturing method thereof
US-2026082941-A1 · Mar 19, 2026 · US
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Hung Wensen patents
Hung Wensen is listed as an inventor on 171 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hung Wensen |
| Total patents | 171 |
| First publication | Feb 5, 2015 |
| Latest publication | Mar 19, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor package and method of manufacturing semiconductor package
US-2026068671-A1 · Mar 5, 2026 · US
Package structure including a package lid with a bottom lid portion and top lid portion and methods for forming the same
US-2026068745-A1 · Mar 5, 2026 · US
Heat spreading device and method
US-12550729-B2 · Feb 10, 2026 · US
Semiconductor package with stiffener structure and method of manufacturing the same
US-12550775-B2 · Feb 10, 2026 · US
Integrated chip package including a crack-resistant lid structure and methods of forming the same
US-12538835-B2 · Jan 27, 2026 · US
Semiconductor package with hotspot control
US-2026005100-A1 · Jan 1, 2026 · US
Heat dissipation for hot spots
US-2025372480-A1 · Dec 4, 2025 · US
Integrated circuit packages and methods
US-2025372572-A1 · Dec 4, 2025 · US
Semiconductor package and method of manufacturing semiconductor package
US-2025372534-A1 · Dec 4, 2025 · US
Recent patents
Latest publications not already listed above.
Integrated circuit packages and methods
US-2025364458-A1 · Nov 27, 2025 · US
Hybrid Vapor Chamber Lid
US-2025364362-A1 · Nov 27, 2025 · US
Semiconductor device and method of forming same
US-2025357447-A1 · Nov 20, 2025 · US
Package assembly and manufacturing method thereof
US-2025357262-A1 · Nov 20, 2025 · US
Electronic apparatus, semiconductor package module and manufacturing method thereof
US-2025357258-A1 · Nov 20, 2025 · US
Thermal performance of stacked dies
US-2025349769-A1 · Nov 13, 2025 · US
Package assembly with back plate compression
US-2025349652-A1 · Nov 13, 2025 · US
Packages with liquid metal as heat-dissipation media and method forming the same
US-2025349668-A1 · Nov 13, 2025 · US
Monitoring system for data center maintenance
US-2025348064-A1 · Nov 13, 2025 · US
Semiconductor package with heat spreading lid
US-2025349666-A1 · Nov 13, 2025 · US
Integrated circuit packages and methods of forming the same
US-2025343104-A1 · Nov 6, 2025 · US
Semiconductor package
US-2025309009-A1 · Oct 2, 2025 · US
Semiconductor device
US-2025309033-A1 · Oct 2, 2025 · US
Method of manufacturing semiconductor package having lid structure
US-12387988-B2 · Aug 12, 2025 · US
Hybrid Vapor Chamber Lid
US-2025246513-A1 · Jul 31, 2025 · US
Package assembly with back plate compression
US-2025226280-A1 · Jul 10, 2025 · US
Semiconductor device
US-12354927-B2 · Jul 8, 2025 · US
Thermal performance of stacked dies
US-2025218987-A1 · Jul 3, 2025 · US
Heat dissipation for hot spots
US-2025218892-A1 · Jul 3, 2025 · US
Semiconductor device and method of forming same
US-2025219030-A1 · Jul 3, 2025 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 155 |
| Taiwan Semiconductor Mfg | 23 |
| Kuo Yung Hsin | 1 |
| Hung Wensen | 1 |
| Yao Po Shi | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 138 |
| H10W40/22 | 133 |
| H10W90/724 | 119 |
| H10W74/15 | 112 |
| H10W90/734 | 96 |