Integrated process flows for hybrid bonding
US-12550662-B2 · Feb 10, 2026 · US
Hung Raymond is listed as an inventor on 19 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hung Raymond |
| Total patents | 19 |
| First publication | Nov 29, 2018 |
| Latest publication | Feb 10, 2026 |
Publications ranked by popularity score, then publication date.
US-12550662-B2 · Feb 10, 2026 · US
US-2026018395-A1 · Jan 15, 2026 · US
US-2025385111-A1 · Dec 18, 2025 · US
US-12347695-B2 · Jul 1, 2025 · US
US-2025167167-A1 · May 22, 2025 · US
US-2024170443-A1 · May 23, 2024 · US
US-11626288-B2 · Apr 11, 2023 · US
US-2023034058-A1 · Feb 2, 2023 · US
US-2022336227-A1 · Oct 20, 2022 · US
US-11424132-B2 · Aug 23, 2022 · US
Latest publications not already listed above.
US-11417568-B2 · Aug 16, 2022 · US
US-2021320034-A1 · Oct 14, 2021 · US
US-2021066064-A1 · Mar 4, 2021 · US
US-2020144073-A1 · May 7, 2020 · US
US-2020091010-A1 · Mar 19, 2020 · US
US-10586707-B2 · Mar 10, 2020 · US
US-10475655-B2 · Nov 12, 2019 · US
US-2019103278-A1 · Apr 4, 2019 · US
US-2018342395-A1 · Nov 29, 2018 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 19 |
| Univ California | 4 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D64/0112 | 10 |
| H10P14/6339 | 6 |
| H01L21/2855 | 6 |
| H10P14/44 | 6 |
| H10P14/43 | 6 |