Methods for selective deposition of tungsten atop a dielectric layer for bottom up gapfill

Patent metadata

Field	Value
Publication number	US-11417568-B2
Application number	US-202016845749-A
Country	US
Kind code	B2
Filing date	Apr 10, 2020
Priority date	Apr 10, 2020
Publication date	Aug 16, 2022
Grant date	Aug 16, 2022

Abstract

Methods and apparatus for selectively depositing a tungsten layer atop a dielectric surface. In embodiments the method includes: depositing a tungsten layer via a physical vapor deposition (PVD) process atop a substrate field and atop a sidewall and a dielectric bottom surface of a feature disposed in a substrate to form a first tungsten portion having a first thickness atop the substrate field, a second tungsten portion having a second thickness atop the sidewall, and a third tungsten portion having a third thickness atop the dielectric bottom surface, wherein the second thickness is less than the first thickness and third thickness; oxidizing a top surface of the tungsten layer to form a first oxidized tungsten portion atop the substrate field, a second oxidized tungsten portion atop the side wall, and a third oxidized tungsten portion atop the dielectric bottom surface; removing the first oxidized tungsten portion, the second oxidized tungsten portion and the third oxidized tungsten portion, wherein the second tungsten portion is completely removed from the sidewall; and passivating or completely removing the first tungsten portion from the substrate field.

First claim

The invention claimed is:

1. A method of selectively depositing a tungsten layer atop a dielectric surface, comprising:
(a) depositing a tungsten layer via a physical vapor deposition (PVD) process atop a substrate field and atop a sidewall and a dielectric bottom surface of a feature disposed in a substrate to form a first tungsten portion having a first thickness atop the substrate field, a second tungsten portion having a second thickness atop the sidewall, and a third tungsten portion having a third thickness atop the dielectric bottom surface, wherein the second thickness is less than the first thickness and third thickness;
(b) oxidizing a top surface of the tungsten layer to form a first oxidized tungsten portion atop the substrate field, a second oxidized tungsten portion atop the sidewall, and a third oxidized tungsten portion atop the dielectric bottom surface;
(c) removing the first oxidized tungsten portion, the second oxidized tungsten portion and the third oxidized tungsten portion, wherein the second tungsten portion is completely removed from the sidewall; and
(d) passivating or completely removing the first tungsten portion from the substrate field.

2. The method of claim 1 , wherein the first thickness is about 7 to 9 nm, the second thickness is about 1 to 3 nm, and the third thickness is about 9 to 11 nm.

3. The method of claim 1 , wherein depositing comprising forming a first thickness and a third thickness that are greater than the second thickness.

4. The method of claim 1 , wherein oxidizing is characterized as conformal or super-conformal.

5. The method of claim 1 , wherein the oxidizing comprises contacting the top surface of the tungsten layer with oxygen plasma.

6. The method of claim 1 , wherein removing comprises contacting the first oxidized tungsten portion, the second oxidized tungsten portion and the third oxidized tungsten portion with WF 6 under conditions sufficient to remove the second oxidized tungsten portion from the sidewall.

7. The method of claim 1 , wherein (b) and (c) are cyclically repeated in cycles sufficient to remove the first tungsten portion from the substrate field, and wherein the third oxidized tungsten portion remains atop the dielectric bottom surface.

8. The method of claim 1 , wherein passivating comprises contacting the first tungsten portion with remote nitrogen plasma at a temperature of about 300 to about 400 degrees Celsius wherein nitrogen is provided at a flow rate of about 0.5 to 5 sccm, or below 5 sccm.

9. The method of claim 1 , wherein passivating comprises contacting the first tungsten portion with remote nitrogen plasma at a pressure of about 500 mTorr to about 1 Torr, wherein nitrogen is provided at a flow rate of about 0.5 to 5 sccm, or below 5 sccm.

10. The method of claim 1 , wherein (a), (b), (c), and (d) are performed sequentially.

11. The method of claim 1 , wherein (b) oxidizing further comprises providing a capacitively-coupled plasma comprising oxygen at a temperature of about 300 degrees Celsius to about 400 degrees Celsius.

12. A method of selectively depositing a tungsten layer atop a dielectric surface, comprising:
(a) depositing a tungsten layer via a physical vapor deposition (PVD) process atop a substrate field and atop a sidewall and a dielectric bottom surface of a feature disposed in a substrate to form a first tungsten portion having a first thickness atop the substrate field, a second tungsten portion having a second thickness atop the sidewall, and a third tungsten portion having a third thickness atop the dielectric bottom surface, wherein the second thickness is less than the first thickness and third thickness; and (b) removing the first tungsten portion, and the second tungsten portion, wherein the first tungsten portion and second tungsten portion are completely removed from the substrate, and wherein the third tungsten portion remains atop the dielectric bottom surface.

13. The method of claim 12 , wherein the first thickness is less than the third thickness.

14. The method of claim 12 , wherein depositing further comprises forming the first thickness less than the third thickness.

15. The method of claim 12 , wherein depositing further comprises forming a first thickness and a third thickness that are greater than the second thickness.

16. The method of claim 12 , wherein the first thickness is about 7 to 9 nm.

17. The method of claim 12 , wherein the second thickness is about 1 to 3 nm.

18. The method of claim 12 , wherein the third thickness is about 9 to 11 nm.

19. The method of claim 12 , wherein the first thickness is about 8 nm, the second thickness is about 2 nm, and the third thickness is about 10 nm.

20. A non-transitory computer readable medium having instructions stored thereon that, when executed, cause a reaction chamber to perform selectively depositing a tungsten layer atop a dielectric surface, comprising:
(a) depositing a tungsten layer via a physical vapor deposition (PVD) process atop a substrate field and atop a sidewall and a dielectric bottom surface of a feature disposed in a substrate to form a first tungsten portion having a first thickness atop the substrate field, a second tungsten portion having a second thickness atop the sidewall, and a third tungsten portion having a third thickness atop the dielectric bottom surface, wherein the second thickness is less than the first thickness and third thickness;
(b) oxidizing a top surface of the tungsten layer to form a first oxidized tungsten portion atop the substrate field, a second oxidized tungsten portion atop the sidewall, and a third oxidized tungsten portion atop the dielectric bottom surface;
(c) removing the first oxidized tungsten portion, the second oxidized tungsten portion and the third oxidized tungsten portion, wherein the second tungsten portion is completely removed from the sidewall; and
(d) passivating or completely removing the first tungsten portion from the substrate field.

Assignees

• Applied Materials Inc

Inventors

• Lei Wei
• Xu Yi
• Lei Yu
• Ha Tae Hong
• Hung Raymond
• Pethe Shirish A

Classifications

• H10P50/267

  using plasmas · CPC title

• H10P14/44

  Physical vapour deposition [PVD] · CPC title

• H10W20/056 Primary

  by filling conductive material into holes, grooves or trenches · CPC title

• H10P14/6319

  Formation by plasma treatments, e.g. plasma oxidation of the substrate · CPC title

• H10P14/6314

  of a metallic layer · CPC title