Tungsten feature fill with nucleation inhibition
US-12444651-B2 · Oct 14, 2025 · US
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Humayun Raashina patents
Humayun Raashina is listed as an inventor on 84 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Humayun Raashina |
| Total patents | 84 |
| First publication | Jan 22, 2015 |
| Latest publication | Oct 14, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Systems and methods for homogenous intermixing of precursors in alloy atomic layer deposition
US-12331396-B2 · Jun 17, 2025 · US
Tungsten feature fill with nucleation inhibition
US-2025149383-A1 · May 8, 2025 · US
Low resistivity films containing molybdenum
US-2024297075-A1 · Sep 5, 2024 · US
Systems and methods for homogenous intermixing of precursors in alloy atomic layer deposition
US-2024084443-A1 · Mar 14, 2024 · US
Feature fill with nucleation inhibition
US-11901227-B2 · Feb 13, 2024 · US
Systems and methods for homogenous intermixing of precursors in alloy atomic layer deposition
US-11827976-B2 · Nov 28, 2023 · US
Metal-containing passivation for high aspect ratio etch
US-11670516-B2 · Jun 6, 2023 · US
Tungsten feature fill with nucleation inhibition
US-2023041794-A1 · Feb 9, 2023 · US
Tungsten feature fill with nucleation inhibition
US-11410883-B2 · Aug 9, 2022 · US
Recent patents
Latest publications not already listed above.
Low resistivity films containing molybdenum
US-2022223471-A1 · Jul 14, 2022 · US
Metal fill process for three-dimensional vertical NAND wordline
US-11348795-B2 · May 31, 2022 · US
Feature fill with nucleation inhibition
US-2022102208-A1 · Mar 31, 2022 · US
Tungsten feature fill
US-2021327754-A1 · Oct 21, 2021 · US
Metal-containing passivation for high aspect ratio etch
US-2021242032-A1 · Aug 5, 2021 · US
Tungsten feature fill
US-11075115-B2 · Jul 27, 2021 · US
Feature fill with multi-stage nucleation inhibition
US-10916434-B2 · Feb 9, 2021 · US
Systems and methods for homogenous intermixing of precursors in alloy atomic layer deposition
US-2020407842-A1 · Dec 31, 2020 · US
Low resistivity films containing molybdenum
US-2020365456-A1 · Nov 19, 2020 · US
Low resistivity films containing molybdenum
US-10777453-B2 · Sep 15, 2020 · US
Depositing ruthenium layers in interconnect metallization
US-10731250-B2 · Aug 4, 2020 · US
Metal fill process for three-dimensional vertical nand wordline
US-2020211853-A1 · Jul 2, 2020 · US
Feature fill with multi-stage nucleation inhibition
US-2020185225-A1 · Jun 11, 2020 · US
Feature fill with nucleation inhibition
US-2020185273-A1 · Jun 11, 2020 · US
Low resistivity films containing molybdenum
US-2020075403-A1 · Mar 5, 2020 · US
Feature fill with nucleation inhibition
US-10580695-B2 · Mar 3, 2020 · US
Feature fill with multi-stage nucleation inhibition
US-10580654-B2 · Mar 3, 2020 · US
Forming low resistivity fluorine free tungsten film without nucleation
US-10546751-B2 · Jan 28, 2020 · US
Tungsten for wordline applications
US-10529722-B2 · Jan 7, 2020 · US
Low resistivity films containing molybdenum
US-10510590-B2 · Dec 17, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 60 |
| Novellus Systems Inc | 24 |
| Humayun Raashina | 2 |
| Danek Michal | 2 |
| Chandrashekar Anand | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P14/43 | 79 |
| H10W20/056 | 65 |
| H10W20/045 | 60 |
| C23C16/045 | 55 |
| H01L21/28556 | 53 |