Metal fill process for three-dimensional vertical NAND wordline

Patent metadata

Field	Value
Publication number	US-11348795-B2
Application number	US-201816638430-A
Country	US
Kind code	B2
Filing date	Aug 10, 2018
Priority date	Aug 14, 2017
Publication date	May 31, 2022
Grant date	May 31, 2022

Abstract

Disclosed are methods of depositing a transition metal such as tungsten on a semiconductor substrate. The method includes providing a gas mixture of diborane with a balance of hydrogen, where the hydrogen serves to stabilize the diborane in the gas mixture. The method further includes delivering the gas mixture to the semiconductor substrate to form a boron layer, where the boron layer serves as a reducing agent layer to convert a metal-containing precursor to metal, such as a tungsten-containing precursor to tungsten. In some implementations, the semiconductor substrate includes a vertical structure, such as a three-dimensional vertical NAND structure, with horizontal features or wordlines having openings in sidewalls of the vertical structure, where the boron layer may be conformally deposited in the horizontal features of the vertical structure.

First claim

What is claimed is:

1. A method comprising:
providing a gas mixture in a gas supply line, wherein the gas mixture is stored in a gas supply source fluidly coupled to the gas supply line and includes diborane (B 2 H 6 ) with a balance of hydrogen (H 2 );
introducing the gas mixture from the gas supply line into a deposition chamber to a surface of a semiconductor substrate, wherein the semiconductor substrate includes a vertical structure having a plurality of horizontally-oriented features, wherein the diborane decomposes to form a boron layer in the horizontally-oriented features; and
converting the boron layer to a transition metal layer in the semiconductor substrate.

2. The method of claim 1 , wherein the gas mixture includes at least 20% by volume of diborane with the balance of hydrogen.

3. The method of claim 2 , wherein the gas mixture includes between about 20% and about 50% by volume of diborane with the balance of hydrogen.

4. The method of claim 1 , wherein the transition metal layer includes molybdenum, ruthenium, cobalt, or tungsten.

5. The method of claim 1 , wherein converting the boron layer to the transition metal layer comprises reacting the boron layer with a tungsten-containing precursor to form a tungsten layer.

6. The method of claim 5 , wherein the tungsten-containing precursor includes tungsten hexafluoride (WF 6 ), tungsten hexachloride (WCl 6 ), or tungsten hexacarbonyl (W(CO) 6 ).

7. The method of claim 1 , wherein the gas mixture is substantially free of nitrogen (N 2 ).

8. The method of claim 1 , wherein the semiconductor substrate has openings in sidewalls of the vertical structure that are fluidically accessible from the vertical structure through the openings.

9. The method of claim 1 , wherein the vertical structure is a three-dimensional (3-D) vertical NAND structure.

10. The method of claim 1 , wherein the boron layer is conformally deposited in the horizontally-oriented features of the vertical structure, the boron layer having a step coverage of at least 90%.

11. The method of claim 1 , wherein introducing the gas mixture comprises pulsing the diborane with the balance of hydrogen for a period of time between about 0.1 seconds and about 10 seconds in a pulsed nucleation layer (PNL) deposition cycle.

12. The method of claim 1 , wherein introducing the gas mixture comprises pulsing the diborane with the balance of hydrogen for a period of time between about 1 second and about 60 seconds.

13. The method of claim 1 , further comprising:
exposing the semiconductor substrate to a reducing gas, wherein the reducing gas includes silane, disilane, or hydrogen.

14. An apparatus comprising:
a gas supply source, wherein the gas supply source stores a gas mixture of diborane with a balance of hydrogen;
a gas supply line fluidly coupled with the gas supply source;
a deposition chamber coupled to the gas supply line, wherein the deposition chamber is configured to process a semiconductor substrate in the deposition chamber, the semiconductor substrate including a vertical structure having a plurality of horizontally-oriented features; and
a controller configured with instructions for performing the following operations:
introducing the gas mixture from the gas supply line into the deposition chamber to a surface of the semiconductor substrate, where the diborane decomposes to form a boron layer in the horizontally-oriented features; and
converting the boron layer to a transition metal layer in the semiconductor substrate.

15. The apparatus of claim 14 , wherein the gas mixture includes at least 200% by volume of diborane with the balance of hydrogen.

16. The apparatus of claim 15 , wherein the gas mixture includes between about 20% and about 50% by volume of diborane with the balance of hydrogen.

17. The apparatus of claim 14 , wherein the transition metal layer includes molybdenum, ruthenium, cobalt, or tungsten.

18. The apparatus of claim 14 , wherein the controller configured with instructions for converting the boron layer is configured with instructions for reacting the boron layer with a transition metal precursor to form the transition metal layer.

19. The apparatus of claim 14 , wherein the semiconductor substrate has openings in sidewalls of the vertical structure that are fluidically accessible from the vertical structure through the openings.

20. The apparatus of claim 14 , wherein the controller is further configured with instructions for performing the following operation:
exposing the semiconductor substrate to a reducing gas, wherein the reducing gas includes silane, disilane, or hydrogen.

Assignees

• Lam Res Corp

Inventors

• Schloss Lawrence
• Humayun Raashina
• Gopinath Sanjay
• Gao Juwen
• Danek Michal
• Ashtiani Kaihan Abidi

Classifications

• H10W20/056

  by filling conductive material into holes, grooves or trenches · CPC title

• H10W20/045

  for deposition from the gaseous phase, e.g. for chemical vapour deposition [CVD] · CPC title

• H10P14/418 Primary

  the conductive layers comprising transition metals · CPC title

• H10P14/432

  using selective deposition · CPC title

• H10B43/27

  the channels comprising vertical portions, e.g. U-shaped channels · CPC title