Information display method and apparatus, computer device and storage medium
US-12499149-B2 · Dec 16, 2025 · US
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Hou Ning patents
Hou Ning is listed as an inventor on 31 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hou Ning |
| Total patents | 31 |
| First publication | Nov 9, 2017 |
| Latest publication | Dec 16, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Camera module having optical image stabilization function, and preparation method therefor
US-12184979-B2 · Dec 31, 2024 · US
Embedded circuit board and manufacturing method thereof
US-12156348-B2 · Nov 26, 2024 · US
Information display method and apparatus, computer device and storage medium
US-2024311418-A1 · Sep 19, 2024 · US
Embedded circuit board and manufacturing method thereof
US-11991838-B2 · May 21, 2024 · US
Embedded circuit board and manufacturing method thereof
US-2024130050-A1 · Apr 18, 2024 · US
Camera module having optical image stabilization function, and preparation method therefor
US-2023379583-A1 · Nov 23, 2023 · US
Multi-sided light-emitting circuit board and manufacturing method thereof
US-11757080-B2 · Sep 12, 2023 · US
Method for manufacturing circuit board with high light reflectivity
US-11696393-B2 · Jul 4, 2023 · US
Battery assembly, battery module, and method for manufacturing the same
US-2023155257-A1 · May 18, 2023 · US
Recent patents
Latest publications not already listed above.
Embedded circuit board and manufacturing method thereof
US-2022225512-A1 · Jul 14, 2022 · US
Method for manufacturing circuit board with high light reflectivity
US-2022217839-A1 · Jul 7, 2022 · US
Circuit board with high light reflectivity and method for manufacturing the same
US-11317506-B2 · Apr 26, 2022 · US
Circuit board, method for manufacturing the same, and backlight
US-11310920-B2 · Apr 19, 2022 · US
Circuit board, method for manufacturing the same, and backlight
US-2021410294-A1 · Dec 30, 2021 · US
Circuit board with high light reflectivity and method for manufacturing the same
US-2021410279-A1 · Dec 30, 2021 · US
Multi-sided light-emitting circuit board and manufacturing method thereof
US-2021384394-A1 · Dec 9, 2021 · US
Method of making a rigid/flex circuit board
US-11140776-B2 · Oct 5, 2021 · US
Flexible printed circuit board, method for manufacturing the same and loudspeaker with the same
US-11057709-B2 · Jul 6, 2021 · US
Method for manufacturing an ultrathin heat dissipation structure
US-10923411-B2 · Feb 16, 2021 · US
Rigid-flex circuit board and method for making same
US-2020154559-A1 · May 14, 2020 · US
Flexible printed circuit board, method for manufacturing the same and loudspeaker with the same
US-10524057-B2 · Dec 31, 2019 · US
Method for manufacturing an ultrathin heat dissipation structure
US-2019320550-A1 · Oct 17, 2019 · US
Ultrathin heat dissipation structure
US-10448540-B2 · Oct 15, 2019 · US
Flexible printed circuit board, method for manufacturing the same and loudspeaker with the same
US-2019281392-A1 · Sep 12, 2019 · US
Method for making circuit board
US-10383223-B2 · Aug 13, 2019 · US
Embedded circuit board and method of making same
US-10356909-B1 · Jul 16, 2019 · US
Method for making circuit board
US-2019098754-A1 · Mar 28, 2019 · US
Circuit board and method for making the same
US-10187984-B1 · Jan 22, 2019 · US
Flexible printed circuit board, method for manufacturing the same and loudspeaker with the same
US-2019007774-A1 · Jan 3, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Avary Holding Shenzhen Co Ltd | 28 |
| Qing Ding Prec Electronics Huaian Co Ltd | 15 |
| Hongqisheng Prec Electronics Qinhuangdao Co Ltd | 11 |
| Garuda Tech Co Ltd | 4 |
| Hong Heng Sheng Electronical Tech Huaian Co Ltd | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K1/09 | 7 |
| H05K3/06 | 7 |
| H05K2201/10636 | 7 |
| H05K1/0274 | 6 |
| H05K2201/2054 | 6 |