Ultrathin heat dissipation structure

Patent metadata

Field	Value
Publication number	US-10448540-B2
Application number	US-201615191550-A
Country	US
Kind code	B2
Filing date	Jun 24, 2016
Priority date	May 9, 2016
Publication date	Oct 15, 2019
Grant date	Oct 15, 2019

Abstract

An ultrathin heat dissipation structure includes a copper clad sheet, a cover, a number of bond blocks, and a phase-change material. The copper clad sheet is given containing grooves and a number of ribs round each containing groove. The containing grooves are formed by stamping. The copper clad sheet includes an insulation layer. The copper clad layer is inner surface of the containing groove. The bond blocks are arranged on the ribs and cover is pressed to the stamped copper clad sheet and secured using the bond blocks. The containing grooves form sealing cavities and the phase-change material in the sealed cavity gathers and transfers out any heat generated by components.

First claim

What is claimed is:

1. A heat dissipation structure comprising:
a copper clad sheet comprising a plurality of containing grooves and a plurality of ribs round each containing groove, each of the plurality of containing grooves formed by stamping, the copper clad sheet comprising an insulation layer and a copper clad layer attached on the insulation layer, wherein a surface of the copper clad layer facing away from the insulation layer forms an inner surface of the plurality of containing grooves, the insulation layer follows a contour of the copper clad layer and has a same shape as that of the copper clad layer;
a plurality of bond blocks arranged on the ribs;
a cover being fixed on the copper clad sheet with the containing groove using the bond blocks, the cover sealing the plurality of containing grooves to form a plurality of a sealed cavities; and
a phase-change material contained in the sealed cavity and configured to absorb and transfer out heat generated by components.

2. The heat dissipation structure of claim 1 , wherein the inner surface of each of the plurality of containing grooves comprises micro-structures.

3. The heat dissipation structure of claim 2 , wherein each of the plurality of containing grooves comprises a bottom wall and a side wall around the bottom wall, and the bottom wall is substantially flat, an angle between the side wall and the bottom wall is 90°<α<180°, a thickness of the side wall is thinner than that of the bottom wall.

4. The heat dissipation structure of claim 1 , wherein the copper clad layer has a same surface area with the insulation layer, and a cross-section shape of the inner surface of each containing groove is same as a cross-section shape of the outer surface of each containing groove.

5. The heat dissipation structure of claim 3 , wherein the cover is made of metal.

6. The heat dissipation structure of claim 3 , wherein a surface area of the copper clad layer is larger than a surface area of the insulation layer.

7. The heat dissipation structure of claim 6 , wherein a surface area of the copper clad layer is two times a surface area of the insulation layer.

8. The heat dissipation structure of claim 7 , wherein the copper clad layer exposed by the insulation layer is turned about 180 degree to form the cover.

9. The heat dissipation structure of claim 1 , wherein the plurality of bond blocks is formed of adhesive by screen printing and solidification of the adhesive, the plurality of bond blocks comprises molten resin material doped with metal particles, the metal particles are selected from a group comprising tin, bismuth, and any combination thereof, a diameter of the metal particle is in a range from about 25 um to 45 um, a weight ratio of tin in the adhesive is in a range from about 37% to 38%, a weight ratio of bismuth in the adhesive is in a range from about 51% to 52%, a weight ratio of molten resin in the bond blocks is in a range from about 4% to 6%.

10. The heat dissipation structure of claim 1 , wherein the phase-change material is solid-liquid phase-change material.

Assignees

• Avary Holding Shenzhen Co Ltd
• Hongqisheng Prec Electronics Qinhuangdao Co Ltd
• Garuda Tech Co Ltd

Inventors

• Hou Ning
• Lei Cong
• Li Biao
• Ho Ming-Jaan

Classifications

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/251

  Organics · CPC title

• H10W40/735

  by melting or evaporation of solids · CPC title

• H10W40/037

  Assembling together parts thereof · CPC title

• H10W40/255 Primary

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title