Camera module having optical image stabilization function, and preparation method therefor

Patent metadata

Field	Value
Publication number	US-12184979-B2
Application number	US-202118034351-A
Country	US
Kind code	B2
Filing date	Jun 29, 2021
Priority date	Jun 29, 2021
Publication date	Dec 31, 2024
Grant date	Dec 31, 2024

Abstract

A camera module having OIS function and its preparation method are provided. The camera module includes a housing and an optical assembly in the housing, and further includes a circuit board in the housing. The circuit board includes a first board and a second board on the first board. The first board is flexible. The first board includes a first portion, a second portion, and a third portion successively connected in an extending direction of the first board. The second portion defines a slot. The second board is on the third portion. The optical assembly is on the second board. The first portion includes a fixed end connecting the second portion and an opposite free end. The housing defines a through hole. The first portion extends through the slot to form a bent portion and extends out of the through hole, such that the free end is outside the housing.

First claim

What is claimed is:

1. A preparation method for a camera module, comprising:
providing a circuit board, wherein the circuit board comprises a first board and a second board formed on the first board, the first board is a flexible circuit board, the first board comprises a first portion, a second portion, and a third portion sequentially connected to each other in an extending direction of the first board, the second portion defines a slot, the second board is formed on the third portion, the first portion comprises a fixed end connecting the second portion and a free end opposite to the fixed end;
installing an optical assembly on the second board to obtain an intermediate body;
providing a housing, wherein the housing defines a through hole;
extending the first portion in the intermediate body through the slot to form a bent portion, and placing the intermediate body with the bent portion inside the housing; and
further extending the first portion which has extended through the slot out of the through hole, causing the free end to be located outside the housing, thereby obtaining the camera module.

2. The preparation method for the camera module according to claim 1 , after extending the first portion out of the through hole, the preparation method further comprising:
forming an adhesive between the through hole and the first portion.

3. The preparation method for the camera module according to claim 1 , wherein the housing is provided with a bottom wall, a top wall, and at least two sidewalls each connected between the bottom wall and the top wall, one of the at least two sidewalls defines the through hole, and
the housing is further provided with an isolation plate located between the at least two sidewalls, the isolation plate divides an interior space of the housing into a first receiving space and a second receiving space, the first receiving space communicate with the through hole, such that the bent portion is located in the first receiving space, the optical assembly, the second board, and the third portion of the first board are located in the second receiving space.

4. The preparation method for the camera module according to claim 3 , wherein the optical assembly comprises a photosensitive chip, a bracket, a filter, and a lens unit; and
installing the optical assembly on the second board comprising installing the photosensitive chip and the bracket on the second board, wherein the photosensitive chip is received in the bracket; the lens unit is installed on the bracket; the bracket is arranged between the lens unit and the second board; the filter is arranged in the bracket.

5. The preparation method for the camera module according to claim 4 , wherein the optical assembly is further provided with a coil and a magnetic component; and
the optical assembly is installed on the second board by placing the coil on one of the at least two sidewalls that without the through hole and away from the bent portion; electrically connecting the coil to the circuit board; and installing the magnetic component on the bracket, so that the circuit board is configured to energize the coil when the optical assembly shakes.

6. The preparation method for the camera module according to claim 1 , wherein providing the circuit board comprises:
providing a circuit substrate, wherein the circuit substrate comprises the first board, an adhesive layer, and the second board stacked together, the second board is formed on the first portion, the second portion, and the third portion, the adhesive layer defines an opening corresponding to the first portion and the second portion; and
removing areas of the second board corresponding to the first and the second portions, thereby obtaining the circuit board.

7. The preparation method for the camera module according to claim 1 , further comprising forming a gap by extending the first portion through the slot, wherein in a width direction of the first board, a width of the slot is greater than a width of the first portion, such that the gap is formed between the slot and the free end.

8. The preparation method for the camera module according to claim 1 , wherein providing the circuit board further comprising arranging wirings of the first board to bypass the slot.

9. The preparation method for the camera module according to claim 1 , further comprising installing an electrical connection portion at the free end.

10. A camera module comprising:
a housing;
an optical assembly located in the housing; and
a circuit board located in the housing, wherein the circuit board comprises a first board and a second board formed on the first board, the first board is a flexible circuit board, the first board comprises a first portion, a second portion, and a third portion successively connected to each other in an extending direction of the first board, the second portion defines a slot, the second board is formed on the third portion, the optical assembly is installed on the second board;
wherein the first portion comprises a fixed end connecting the second portion and a free end opposite the fixed end, the housing defines a through hole, the first portion extends through the slot to form a bent portion, the first portion further extends out of the through hole to cause the free end to be located outside the housing.

11. The camera module according to claim 10 , wherein the bent portion is formed by bending the first portion by at least two circles.

12. The camera module according to claim 10 , wherein a height of the bent portion is smaller than a thickness of the housing in a thickness direction of the first board.

13. The camera module according to claim 10 , further comprising an adhesive between the through hole and the first portion.

14. The camera module according to claim 10 , wherein the housing comprises a bottom wall, a top wall, and at least two sidewalls each connected between the bottom wall and the top wall, one of the at least two sidewalls defines the through hole;
the housing further comprises an isolation plate located between the at least two sidewalls, the isolation plate divides an interior space of the housing into a first receiving space and a second receiving space, the first receiving space communicate with the through hole, such that the bent portion is located in the first receiving space, the optical assembly, the second board, and the third portion of the first board are located in the second receiving space.

15. The camera module according to claim 14 , wherein the optical assembly comprises a photosensitive chip, a bracket, a filter, and a lens unit; the photosensitive chip and the bracket are located on the second board, the photosensitive chip is received in the bracket; the lens unit is installed on the bracket; the bracket is arranged between the lens unit and the second board; the filter is arranged in the bracket.

16. The camera module according to claim 15 , wherein the optical assembly further comprises a coil and a magnetic component; the coil is located on one of the at least two sidewalls that without the through hole and away from the bent portion; the coil is electrically connected to the circuit board; the magnetic component is installed on the bracket, so that the circuit board is configured to energize the coil when the optical assembly shakes.

17. The camera module according to claim 10 , wherein in a width direction of the first board, a width of the first portion is smaller than a width of the second portion, and the width of the second portion is equal to a width of the third portion.

Assignees

• Avary Holding Shenzhen Co Ltd
• Qing Ding Prec Electronics Huaian Co Ltd

Inventors

• She xue-feng
• Song Qiang
• Huang Mei-Hua
• Hou Ning

Classifications

• G03B2205/0069

  using electromagnetic actuators, e.g. voice coils · CPC title

• G03B2205/0007

  Movement of one or more optical elements for control of motion blur · CPC title

• G03B5/00

  Adjustment of optical system relative to image or object surface other than for focusing · CPC title

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/51

  Housings · CPC title