Method of making a rigid/flex circuit board

Patent metadata

Field	Value
Publication number	US-11140776-B2
Application number	US-201916713337-A
Country	US
Kind code	B2
Filing date	Dec 13, 2019
Priority date	Nov 9, 2018
Publication date	Oct 5, 2021
Grant date	Oct 5, 2021

Abstract

Manufacturing a rigid-flex circuit board includes providing an inner flexible circuit board and a first flexible metal clad laminate, laminating the first flexible metal clad laminate on a surface of the inner flexible circuit board through a first adhesive film, causing the first copper layer to form a third conductive circuit layer, partially covering the metal protective layer exposed by the third conductive circuit layer, removing the metal protective layer exposed by the third conductive circuit layer and the covered area, providing a second copper foil, laminating the second copper foil on a surface of the third conductive circuit layer through a second adhesive film, removing the metal protective layer at the opening area, and causing the second copper foil to form a fifth conductive circuit layer. The first flexible metal clad laminate includes a second base material layer, a metal protective layer, and a first copper layer.

First claim

What is claimed is:

1. A method for manufacturing a rigid-flex circuit board, comprising the following steps:
providing an inner flexible circuit board and a first flexible metal clad laminate, and laminating the first flexible metal clad laminate on a surface of the inner flexible circuit board through a first adhesive film, wherein the first flexible metal clad laminate comprises a second base material layer laminated on a surface of the first adhesive film, a metal protective layer formed on a surface of the second base material layer, and a first copper layer formed on a surface of the metal protective layer, wherein the metal protective layer serves as a seed layer, which enhances a copper effect of the first copper layer on the second base material layer;
etching the first copper layer to form a third conductive circuit layer, wherein a portion of the metal protective layer is exposed by the third conductive circuit layer;
partially covering the metal protective layer exposed by the third conductive circuit layer, and removing the metal protective layer exposed by the third conductive circuit layer and the covered area;
providing a second copper foil, and laminating the second copper foil on a surface of the third conductive circuit layer through a second adhesive film, wherein the second copper foil and the second adhesive film go through a pre-opening processing to form an opening area, the opening area located at the remaining metal protective layer;
removing the metal protective layer at the opening area, wherein an edge of the opening area has the metal protective layer; and
etching the second copper foil to form a fifth conductive circuit layer.

2. The method for manufacturing a rigid-flex circuit board according to claim 1 , wherein causing the first copper layer to form a third conductive circuit layer comprises: performing an opening process on the inner flexible circuit board and the laminated first base material layer, opening a first through hole and a plurality of first receiving holes in the first flexible metal clad laminate, the first through hole penetrating through the two first flexible metal clad laminates, the two first adhesive films, and the inner flexible circuit board, the first receiving hole penetrating the first flexible metal clad laminate and the first adhesive film and exposing the inner flexible circuit board; performing electroplating and etching processes on the first flexible metal clad laminate, so that the first copper layer on the first flexible metal clad laminate is etched to form a third conductive circuit layer, and the inner flexible circuit board and the third conductive circuit layer are electrically connected to each other.

3. The method for manufacturing a rigid-flex circuit board according to claim 1 , wherein before the step of removing the metal protective layer at the opening area, the method further comprises: performing an opening process, a second receiving hole is formed in the second copper foil, the second receiving hole penetrates the second copper foil and the second adhesive film; and then a shadow processing is performed on the structure obtained in the previous step.

4. The method for manufacturing a rigid-flex circuit board according to claim 1 , wherein the inner flexible circuit board comprises a first base material layer and a first conductive circuit layer and a second conductive circuit layer formed on opposite surfaces of the first base material layer and electrically connected together.

5. The method for manufacturing a rigid-flex circuit board according to claim 1 , wherein the metal protective layer exposed by the third conductive circuit layer is partially covered, removing the metal protective layer exposed by the third conductive circuit layer and the covered area comprises: partially covering the metal protective layer exposed by the third conductive circuit layer with a dry film, removing the metal protective layer exposed by the third conductive circuit layer and the covered area, and removing the dry film.

6. The method for manufacturing a rigid-flex circuit board according to claim 1 , wherein the material of the metal protective layer is selected from one of Ni, Cr, Ti, Cu, Ag, Al, Zn, Sn, and Fe.

Assignees

• Qing Ding Prec Electronics Huaian Co Ltd
• Avary Holding Shenzhen Co Ltd

Inventors

• Hou Ning
• Li wei-xiang

Classifications

• H05K3/4691 Primary

  Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers · CPC title

• H05K1/028 Primary

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

• H05K2201/058

  Direct connection between two or more FPCs or between flexible parts of rigid PCBs · CPC title

• H05K3/22

  Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)} · CPC title

• H05K3/06

  the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} · CPC title