Flexible printed circuit board, method for manufacturing the same and loudspeaker with the same

Patent metadata

Field	Value
Publication number	US-11057709-B2
Application number	US-201916426200-A
Country	US
Kind code	B2
Filing date	May 30, 2019
Priority date	Jun 30, 2017
Publication date	Jul 6, 2021
Grant date	Jul 6, 2021

Abstract

A method for manufacturing a flexible printed circuit board comprising: providing a first flexible precursor board having a layer; adhering a first covering layer with a lower opening, a portion of the circuit layer exposed; adhering a second covering layer with an upper opening to the first covering layer, the upper opening being formed in the lower opening, and a portion of circuit layer being exposed to obtain a second flexible precursor board; providing an upper mound having a protruding portion and a lower mound having a recessed portion, moving the second flexible precursor board between the upper mound and the lower mound, the upper opening being positioned away from the protruding portion and the recessed portion, pressing the upper mound to the lower mound to press the protruding portion into the recessed portion; removing the upper mound and the lower mound to get the flexible printed circuit board.

First claim

What is claimed is:

1. A method for manufacturing a flexible printed circuit board, the method comprising:
providing a first flexible precursor board having at least one circuit layer;
adhering a first covering layer with a lower opening to the circuit layer, a portion of the circuit layer exposed by the lower opening;
adhering a second covering layer with an upper opening to the first covering layer, the upper opening being formed in the lower opening, and a portion of circuit layer being exposed by the upper opening to obtain a second flexible precursor board;
providing an upper mold having a protruding portion and a lower mold having a recessed portion, moving the second flexible precursor board between the upper mold and the lower mold, a portion of the second flexible precursor board being positioned between the protruding portion and the recessed portion, a periphery of the second flexible precursor board being positioned away from the protruding portion and the recessed portion, the upper opening being positioned away from the protruding portion and the recessed portion, pressing the upper mold to the lower mold to press the protruding portion into the recessed portion; and
removing the upper mold and the lower mold to obtain the flexible printed circuit board.

2. The method of claim 1 , wherein the second covering layer comprises a covering portion and an inserting portion, the covering portion is formed on a top surface of the first covering layer, and the inserting portion is received on an inner surface of the lower opening and defines the upper opening.

3. The method of claim 1 further comprises forming a coating layer on the circuit layer exposed from the upper opening after getting the second flexible precursor board.

Assignees

• Avary Holding Shenzhen Co Ltd
• Hongqisheng Prec Electronics Qinhuangdao Co Ltd

Inventors

• Li Biao
• Hou Ning
• Zhong Hao-Wen
• Kang xiao-wei

Classifications

• H05K1/028 Primary

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title

• H04R9/06 Primary

  Loudspeakers · CPC title

• H04R31/006

  Interconnection of transducer parts (of diaphragm and outer suspension by moulding H04R31/003) · CPC title

• H04R31/003 Primary

  for diaphragms or their outer suspension · CPC title