Sleeve
US-D1086408-S · Jul 29, 2025 · US
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Higuchi Shingo patents
Higuchi Shingo is listed as an inventor on 35 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Higuchi Shingo |
| Total patents | 35 |
| First publication | Jan 6, 2015 |
| Latest publication | Jul 29, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Pipe joint
US-2025092968-A1 · Mar 20, 2025 · US
Gasket and flow passage joint structure
US-12158222-B2 · Dec 3, 2024 · US
Semiconductor device and method for manufacturing semiconductor device
US-12057362-B2 · Aug 6, 2024 · US
Sealing member and pipe joint
US-12031645-B2 · Jul 9, 2024 · US
Inner ring and pipe joint
US-12025244-B2 · Jul 2, 2024 · US
Pipe joint
US-2024044425-A1 · Feb 8, 2024 · US
Gasket and flow passage joint structure
US-2023349492-A1 · Nov 2, 2023 · US
Resin joint, channel block, and fluid control device
US-11708928-B2 · Jul 25, 2023 · US
Inner ring and pipe joint
US-2023175621-A1 · Jun 8, 2023 · US
Recent patents
Latest publications not already listed above.
Rolling diaphragm pump
US-11668292-B2 · Jun 6, 2023 · US
Inner ring and pipe joint
US-2023151911-A1 · May 18, 2023 · US
Gasket
US-D985739-S · May 9, 2023 · US
Sealing member and pipe joint
US-2023039578-A1 · Feb 9, 2023 · US
Resin joint, channel block, and fluid control device
US-2023045298-A1 · Feb 9, 2023 · US
Rolling diaphragm pump
US-2022213882-A1 · Jul 7, 2022 · US
Semiconductor device and method for manufacturing semiconductor device
US-2021313245-A1 · Oct 7, 2021 · US
Semiconductor device and method for manufacturing semiconductor device
US-11069591-B2 · Jul 20, 2021 · US
Semiconductor device and method for manufacturing semiconductor device
US-2019393116-A1 · Dec 26, 2019 · US
Flow path chip and manufacturing method for flow path chip
US-2019348683-A1 · Nov 14, 2019 · US
Semiconductor device and method for manufacturing semiconductor device
US-10431516-B2 · Oct 1, 2019 · US
Semiconductor device including a protective film
US-9698112-B2 · Jul 4, 2017 · US
Semiconductor device and method for manufacturing semiconductor device
US-2017162463-A1 · Jun 8, 2017 · US
Semiconductor device and method for manufacturing semiconductor device
US-9601441-B2 · Mar 21, 2017 · US
Wireless communication apparatus and communication method
US-2016353395-A1 · Dec 1, 2016 · US
Semiconductor device including a protective film
US-2016300805-A1 · Oct 13, 2016 · US
Semiconductor device including a protective film
US-9391037-B2 · Jul 12, 2016 · US
Semiconductor device and method for manufacturing semiconductor device
US-2016181210-A1 · Jun 23, 2016 · US
Semiconductor device and method for manufacturing semiconductor device
US-9312228-B2 · Apr 12, 2016 · US
Semiconductor device including a protective film
US-2015380372-A1 · Dec 31, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Rohm Co Ltd | 18 |
| Nippon Pillar Packing | 15 |
| Mitsubishi Electric Corp | 1 |
| Alps Alpine Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/9415 | 18 |
| H10W72/07251 | 18 |
| H10W72/952 | 18 |
| H10W72/923 | 18 |
| H10W72/251 | 18 |