Semiconductor device including a protective film

Patent metadata

Field	Value
Publication number	US-9698112-B2
Application number	US-201615185629-A
Country	US
Kind code	B2
Filing date	Jun 17, 2016
Priority date	Jul 4, 2008
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

A semiconductor device includes a semiconductor chip having a wire and a passivation film formed on the outermost surface with an opening partially exposing the wire. A resin layer is stacked on the semiconductor chip and provided with a through-hole in a position opposed to a portion of the wire facing the opening. A pad is formed on a peripheral portion of the through-hole in the resin layer and in the through-hole so that an external connection terminal is arranged on the surface thereof. The peripheral portion of the resin layer is formed more thickly than the remaining portion of the resin layer other than the peripheral portion.

First claim

What is claimed is:

1. A semiconductor device comprising:
a semiconductor chip including a wire and a first protective film formed over a surface of the wire and a side surface of the wire with an opening partially exposing the wire;
a second protective film stacked over the semiconductor chip and provided with a through-hole on the surface of the wire and covering the side surface of the first protective film;
a metal portion formed over the second protective film and the wire so that the through-hole is filled with the metal portion and that a top surface of the metal portion is spread over the surface of the second protective film; and
a solder ball formed on the metal portion;
wherein the second protective film has a first thick portion provided next to the through-hole;
wherein the second protective film has a first thin portion next to the first thick portion, the first thin portion being thinner than the first thick portion;
wherein the second protective film has a second thick portion next to the first thin portion, the second thick portion being thicker than the first thin portion, and
wherein both the first thin portion and the second thick portion are formed on the first protective film, and the first thick portion is formed on the wire.

2. The semiconductor device according to claim 1 , wherein the second protective film has a second thin portion next to the second thick portion.

3. The semiconductor device according to claim 2 , wherein the second thin portion is formed on the first protective film.

4. The semiconductor device according to claim 1 , wherein the opening is formed symmetrically around a center thereof.

5. The semiconductor device according to claim 1 , wherein the first thick portion is formed symmetrically around a center of the opening.

6. The semiconductor device according to claim 1 , wherein the first thin portion is formed symmetrically around a center of the opening.

7. The semiconductor device according to claim 1 , wherein the metal portion includes a filled portion filling up the through-hole, and a planar portion integral with the filled portion and spread over the second protective film outside the through-hole, thereby having a generally T-shaped cross section.

8. The semiconductor device according to claim 7 , wherein a surface of the planar portion has a recessed portion about a center thereof.

9. The semiconductor device according to claim 8 , wherein the solder ball partially enters the recess.

10. The semiconductor device according to claim 1 , wherein the second protective film includes polyimide.

11. The semiconductor device according to claim 1 , wherein the first protective film includes a nitride film.

12. The semiconductor device according to claim 1 , wherein the metal portion is fitted to the second protective film and is in close contact with the second protective film.

Assignees

• Rohm Co Ltd

Inventors

• Higuchi Shingo

Classifications

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title

• H10W72/07251

  characterised by changes in properties of the bump connectors during connecting · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/934

  Cross-sectional shape, i.e. in side view · CPC title

• H10W72/923

  Bond pads having multiple stacked layers · CPC title