Substrate structure with selective surface finishes for flip chip assembly
US-10607960-B2 · Mar 31, 2020 · US
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Hartmann Robert patents
Hartmann Robert is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hartmann Robert |
| Total patents | 8 |
| First publication | Feb 9, 2017 |
| Latest publication | Mar 31, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
Substrate structure with selective surface finishes for flip chip assembly
US-2019229087-A1 · Jul 25, 2019 · US
Substrate structure with selective surface finishes for flip chip assembly
US-10283480-B2 · May 7, 2019 · US
Semiconductor package having a substrate structure with selective surface finishes
US-9935066-B2 · Apr 3, 2018 · US
Low pressure encapsulant for size-reduced semiconductor package
US-9646857-B2 · May 9, 2017 · US
Low pressure encapsulant for size-reduced semiconductor package
US-2017047232-A1 · Feb 16, 2017 · US
Semiconductor package having a substrate structure with selective surface finishes
US-2017040273-A1 · Feb 9, 2017 · US
Substrate structure with selective surface finishes for flip chip assembly
US-2017040276-A1 · Feb 9, 2017 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Qorvo Us Inc | 8 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/114 | 8 |
| H10W90/724 | 6 |
| H10W74/00 | 6 |
| H10W72/07236 | 6 |
| H10W72/07234 | 6 |