Low pressure encapsulant for size-reduced semiconductor package

Patent metadata

Field	Value
Publication number	US-9646857-B2
Application number	US-201615236586-A
Country	US
Kind code	B2
Filing date	Aug 15, 2016
Priority date	Aug 14, 2015
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

The present disclosure relates to a packaging process using a low pressure encapsulant. According to an exemplary process, an assembly including a substrate, a surface mounted device (SMD) mounted on the substrate, and a space between the SMD and the substrate is provided. The SMD has a sealed cavity biased towards the substrate. A sheet mold compound is laid over the SMD and the assembly is heated such that the sheet mold compound transitions to a liquid phase to form a molten mold compound. Next, the assembly is subjected to a vacuum that creates a negative atmosphere allowing the molten mold compound to flow towards the top surface of the substrate and about the SMD. The molten mold compound is then pressed towards the substrate at a low pressure (<=2 Mpa) such that the space between the SMD and the substrate is substantially filled and the SMD is substantially encapsulated.

First claim

What is claimed is:

1. A method comprising:
providing an assembly comprising a substrate having a top surface, a surface mounted device (SMD) mounted on the top surface of the substrate, and a space between the SMD and the top surface of the substrate, wherein the SMD has at least one sealed cavity that is biased towards the top surface of the substrate;
laying a sheet mold compound over the SMD and portions of the top surface of the substrate about the SMD;
heating the assembly such that the sheet mold compound transitions to a liquid phase to form a molten mold compound;
subjecting the assembly to a vacuum that creates a negative atmosphere to allow the molten mold compound to flow towards the top surface of the substrate and about the SMD;
pressing the molten mold compound toward the top surface of the substrate at a low pressure such that the space between the SMD and the top surface of the substrate is substantially filled and the SMD is substantially encapsulated, wherein the low pressure is no more than 2 Mpa;
curing the molten mold compound to provide a cured mold compound; and
planarizing a top surface of the cured mold compound.

2. The method of claim 1 wherein a depth of the at least one sealed cavity of the SMD is between 15 μm and 25 μm.

3. The method of claim 1 wherein the SMD includes a flip-chip die and a wafer level packaged (WLP) structure at a bottom surface of the flip-chip die, wherein the at least one sealed cavity is formed between the bottom surface of the flip-chip die and the WLP structure.

4. The method of claim 3 wherein the WLP structure comprises outer walls and a roof, wherein the outer walls reside at the bottom surface of the flip-chip die biased towards the top surface of the substrate and the roof covers the outer walls to form the at least one sealed cavity.

5. The method of claim 4 wherein a thickness of the roof is between 20 μm and 45 μm.

6. The method of claim 3 wherein the WLP structure is formed from photosensitive permanent resist film.

7. The method of claim 3 wherein the flip-chip die is a bulk acoustic wave (BAW) filter die.

8. The method of claim 7 wherein a height of the SMD is between 190 μm and 210 μm.

9. The method of claim 3 wherein the flip-chip die is a surface acoustic wave (SAW) filter die.

10. The method of claim 9 wherein a height of the SMD is between 220 μm and 280 μm.

11. The method of claim 1 wherein the sheet mold compound comprises a thermoset epoxy resin with silica particles, wherein each of the silica particles has a maximum size no larger than 20 μm.

12. The method of claim 1 further comprising placing perimeter walls on liquid phase, such that the molten mold compound is prevented from flowing beyond the periphery of the substrate.

13. The method of claim 12 further comprising removing the perimeter walls.

14. The method of claim 1 further comprising applying a film assisting material over the sheet mold compound before heating the assembly, wherein the film assisting material does not melt during the heating step.

15. The method of claim 14 wherein the film assisting material comprises a polyethylene terephthalate (PET) material that has a higher melting point than the sheet mold compound.

16. The method of claim 14 further comprising removing the film assisting material before grinding the top surface of the cured mold compound.

17. The method of claim 1 further comprising cooling the assembly after pressing the molten mold compound toward the top surface of the substrate.

18. The method of claim 1 wherein the assembly is heated at a temperature between 120° C. and 180° C.

19. The method of claim 1 wherein the pressure is no less than 0.5 Mpa.

20. The method of claim 1 wherein pressing the molten mold compound toward the top surface of the substrate is provided by a bladder press.

21. The method of claim 1 wherein pressing the molten mold compound is processed with heat between 120° C. and 180° C.

22. The method of claim 1 wherein the sheet mold compound is cured at a temperature between 150° C. and 200° C.

Assignees

• Qorvo Us Inc

Inventors

• Glascock Howard Terry
• Juskey Frank
• Morris Thomas Scott
• Carpenter Charles E
• Hartmann Robert

Classifications

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/129

  forming a chip-scale package [CSP] · CPC title

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• H10W74/016 Primary

  using moulds · CPC title