Full package vapor chamber with IHS
US-11832419-B2 · Nov 28, 2023 · US
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Hackenberg Ken P patents
Hackenberg Ken P is listed as an inventor on 9 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hackenberg Ken P |
| Total patents | 9 |
| First publication | Jul 5, 2018 |
| Latest publication | Nov 28, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Multi-chip packages and sinterable paste for use with thermal interface materials
US-11404349-B2 · Aug 2, 2022 · US
Full package vapor chamber with ihs
US-2021195798-A1 · Jun 24, 2021 · US
Sintered solder for fine pitch first-level interconnect (FLI) applications
US-10515914-B2 · Dec 24, 2019 · US
Multi-chip packages and sinterable paste for use with thermal interface materials
US-2019267306-A1 · Aug 29, 2019 · US
Sintered solder for fine pitch first-level interconnect (fli) applications
US-2019157225-A1 · May 23, 2019 · US
Compressible media applicator, application system and methods for same
US-2019099777-A1 · Apr 4, 2019 · US
Sintered solder for fine pitch first-level interconnect (FLI) applications
US-10224299-B2 · Mar 5, 2019 · US
Sintered solder for fine pitch first-level interconnect (fli) applications
US-2018190604-A1 · Jul 5, 2018 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 9 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/20 | 6 |
| H10W90/722 | 6 |
| H10W90/00 | 4 |
| H10W40/22 | 4 |
| H10W72/29 | 4 |