High voltage power electronics module for subsea applications under high hydrostatic pressure and temperature variations

Patent metadata

Field	Value
Publication number	US-9984948-B2
Application number	US-201715586928-A
Country	US
Kind code	B2
Filing date	May 4, 2017
Priority date	Jun 15, 2016
Publication date	May 29, 2018
Grant date	May 29, 2018

Abstract

A power electronics module includes: a baseplate, a power semiconductor chip arranged on the baseplate, and an encapsulation structure arranged on the baseplate and configured to encapsulate the power semiconductor chip, wherein the encapsulation structure is an epoxy having an elastic modulus in a range of 1 to 20 Giga Pascal, GPa, at room temperature and a coefficient of thermal expansion less than 20 ppm/K.

First claim

The invention claimed is:

1. A high voltage power electronics module for subsea applications, wherein the power electronics module comprises:
a baseplate,
a power semiconductor chip arranged on the baseplate, and
an encapsulation structure arranged on the baseplate and configured to encapsulate the power semiconductor chip,
wherein the encapsulation structure is an epoxy having an elastic modulus in a range of 1 to 20 Giga Pascal, GPa, at room temperature and a coefficient of thermal expansion less than 20 ppm/K.

2. The power electronics module as claimed in claim 1 , wherein the coefficient of thermal expansion is in the range of 10-12 ppm/K.

3. The power electronics module as claimed in claim 1 , wherein the epoxy has a filler content of at least 75% by weight.

4. The power electronics module as claimed in claim 1 , wherein in any cross-section through the encapsulation structure, perpendicular to a plane (P) defined by a surface of the baseplate on which the power semiconductor chip is arranged, the encapsulation structure has rounded inner corners.

5. The power electronics module as claimed in claim 4 , wherein each of said rounded inner corners has a radius (r) of at least 1 mm.

6. The power electronics module as claimed in claim 4 , wherein in said any cross-section through the encapsulation structure, perpendicular to said plane (P) defined by said surface of the baseplate on which the power semiconductor chip is arranged, the encapsulation structure has rounded outer corners.

7. The power electronics module as claimed in claim 6 , wherein each of said rounded outer corners has a radius (r) of at least 1 mm.

8. The power electronics module as claimed in claim 6 , wherein in said any cross-section through the encapsulation structure, each of said rounded inner corners is connected by an inclined line to one of said rounded outer corners, each inclined line forming an outer boundary of the encapsulation structure.

9. The power electronics module as claimed in claim 8 , wherein an outer angle (α) between at least one of the inclined lines and said plane (P) is an obtuse angle.

10. The power electronics module as claimed in claim 9 , wherein the outer angle (α) between at least one of the inclined lines and said plane (P) is at least 100 degrees.

11. The power electronics module as claimed in claim 9 , wherein the outer angle (α) between at least one of the inclined lines and said plane (P) is about 105 degrees.

12. The power electronics module as claimed in claim 1 , wherein the power electronics module is configured to be operated on at least 1700 V.

13. The power electronics module as claimed in claim 1 , wherein the power electronics module is an IGBT module.

14. The power electronics module as claimed in claim 1 , wherein in any cross-section through the encapsulation structure, perpendicular to a plane (P) defined by a surface of the baseplate on which the power semiconductor chip is arranged, the encapsulation structure has rounded outer corners.

15. The power electronics module as claimed in claim 14 , wherein each of said rounded outer corner has a radius (r) of at least 1 mm.

16. A subsea module comprising:
a flexible enclosure,
a dielectric fluid for counteracting mechanical deformation of the flexible enclosure, and
a high voltage power electronics module immersed in the dielectric fluid, said power electronics module having:
a baseplate,
a power semiconductor chip arranged on the baseplate, and
an encapsulation structure arranged on the baseplate and configured to encapsulate the power semiconductor chip,

wherein the encapsulation structure is an epoxy having an elastic modulus in a range of 1 to 20 Giga Pascal, GPa, at room temperature and a coefficient of thermal expansion less than 20 ppm/K.

17. A high voltage power electronics module for a subsea application, wherein the power electronics module comprises:
a baseplate,
a power semiconductor chip arranged on the baseplate, the power semiconductor chip being configured to transmit high voltage in the subsea application, and
an encapsulation structure arranged on the baseplate and configured to encapsulate the power semiconductor chip, the encapsulation structure being an epoxy which has an elastic modulus in a range of 1 to 20 Giga Pascal, GPa, at room temperature and a coefficient of thermal expansion less than 20 ppm/K.

Assignees

• Abb Schweiz Ag

Inventors

• Guillon David
• Lendenmann Heinz
• Huang Hui

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W76/138

  having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H10W72/01515

  Forming coatings · CPC title