Semiconductor package having etched foil capacitor integrated into leadframe
US-9373572-B2 · Jun 21, 2016 · US
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Dunne Rajiv patents
Dunne Rajiv is listed as an inventor on 5 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Dunne Rajiv |
| Total patents | 5 |
| First publication | May 12, 2015 |
| Latest publication | Jun 21, 2016 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor Package Having Etched Foil Capacitor Integrated Into Leadframe
US-2016035655-A1 · Feb 4, 2016 · US
Semiconductor package having etched foil capacitor integrated into leadframe
US-9165873-B1 · Oct 20, 2015 · US
Semiconductor package having etched foil capacitor integrated into leadframe
US-9142496-B1 · Sep 22, 2015 · US
Coaxial four-point probe for low resistance measurements
US-9030216-B2 · May 12, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Texas Instruments Inc | 5 |
| Lamson Michael Anthony | 1 |
| Gurrum Siva Prakash | 1 |
| Dunne Rajiv | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P54/00 | 4 |
| H10W70/04 | 4 |
| H10W70/475 | 4 |
| H01L23/49589 | 4 |
| H10W90/756 | 3 |