Coaxial four-point probe for low resistance measurements

Patent metadata

Field	Value
Publication number	US-9030216-B2
Application number	US-201213443065-A
Country	US
Kind code	B2
Filing date	Apr 10, 2012
Priority date	May 22, 2008
Publication date	May 12, 2015
Grant date	May 12, 2015

Abstract

Various exemplary embodiments provide probes, systems and methods for measuring an effective electrical resistance/resistivity with high sensitivity. In one embodiment, the measuring system can include an upper probe set and a similar lower probe set having a sample device sandwiched there-between. The device-under-test (DUT) samples can be sandwiched between two conductors of the sample device. Each probe set can have an inner voltage sense probe coaxially configured inside an electrically-isolated outer current source probe that has a large contact area with the sample device. The measuring system can also include a computer readable medium for storing circuit simulations including such as FEM simulations for extracting a bulk through-plane electrical resistivity and an interface resistivity for an effective electrical z-resistivity of the DUT, in some cases, having sub-micro-ohm resistance.

First claim

What is claimed is:

1. A method for measuring an effective electrical resistivity comprising:
providing a sample device comprising a top conductor and a bottom conductor such that a device under test (DUT) is able to be configured there-between for measuring an effective electrical resistivity of the DUT;
providing a coaxial four-point measuring configuration comprising an upper coaxial probe set contacting the top conductor of the sample device and a lower coaxial probe set contacting the bottom conductor of the sample device, wherein the upper and lower coaxial probe sets have a common center across the sample device;
sandwiching the sample device between the upper coaxial probe set and the lower coaxial probe set of the coaxial four-point probe configuration;
wherein each of the upper and the lower coaxial probe sets comprises a flexible inner voltage sense probe that is electrically isolated from and coaxially configured within an outer current source probe; the outer current source probe comprising a hollow tip portion having a flat surface area; the inner voltage sense probe comprising an exposed inner conductive portion protruding through the hollow tip portion over the flat surface area;

supporting the lower coaxial probe set with a lower brass plate surrounding the lower coaxial probe;
surrounding the upper coaxial probe set with an upper insulating plate, comprising a plastic and is loosely attached and spring loaded against the lower brass plate;
guiding the lower probe set with a lower insulating collar to maintain the common center with the upper probe set;
applying a current to the upper coaxial probe set through the outer current source probe to the DUT within the sample device; and
performing a circuit simulation to determine the effective electrical resistivity of the DUT.

2. The method of claim 1 , wherein performing the circuit simulation comprises:
measuring a total resistance of each of a plurality of DUTs through a sensed voltage drop across the DUT from the inner voltage sense probe;
measuring a thickness of each corresponding DUT; and
forming a lookup table for the effective electrical resistivity as a function of the measured total resistance and the measured thickness.

3. The method of claim 1 , wherein performing the circuit simulation comprises extracting a bulk electrical z-resistivity and an interface resistivity of the DUT using a one-dimensional interface resistance model.

4. The method of claim 1 , wherein the current is applied by connecting the upper outer current source probe to a constant current supply using a stranded copper wire, while the lower outer current source probe is electrically grounded.

5. The method of claim 1 , further comprising connecting a voltmeter to the inner voltage sense probe of each coaxial probe set for measuring the effective electrical resistance of about 0.1 micro-ohm or less.

6. The method of claim 1 , further comprising assembling a mechanical support for the coaxial four-point probe configuration, wherein the assembling comprises,
surrounding the lower coaxial probe set with a lower brass plate;
surrounding the upper coaxial probe set with an upper insulating plate, wherein the upper insulating plate is loosely attached and spring loaded against the lower brass plate; and
guiding the lower coaxial probe set using a lower insulating collar to allow the lower coaxial probe set and the upper coaxial probe set to have a common center across the sample device.

7. The method of claim 1 , further comprising measuring the effective electrical resistivity of a DUT that comprises a metal, a conductive paste, an eutectic solder, or a conductive polymer.

8. The method of claim 1 , wherein the effective electrical resistivity is measured in a range of about 1 to about 10000 micro-ohm-cm for the sample device having a thickness of about 50 microns to about 5000 microns and for the DUT having a thickness of about 1 micron to about 1000 microns.

9. A system for measuring an effective electrical resistivity comprising:
a sample device for configuring a device under test (DUT) sandwiched between two metal conductors;
a coaxial four-point measuring configuration comprising an upper coaxial probe set and a lower coaxial probe set to sandwich the sample device there-between, wherein the upper coaxial probe set and the lower coaxial probe set are essentially identical and each coaxial probe set comprises,
a flexible inner conductor positioned coaxially within an outer conductive sheath, wherein the outer conductive sheath comprises a hollow conductive tip portion that comprises a flat surface having a surface area, and wherein the flexible inner conductor comprises an inner conductive tip protruding through the hollow conductive tip portion of the outer conductive sheath and over the flat surface thereof

a set of mechanical supports comprising:
a lower brass plate surrounding the lower coaxial probe set to support the lower coaxial probe set;
an upper insulating plate surrounding the upper coaxial probe set, wherein the upper insulating plate comprises a plastic and is loosely attached and spring loaded against the lower brass plate;
a lower insulating collar configured to guide the lower probe set to maintain the common center with the upper probe set; and
a computer readable non-transitory medium for storing a circuit simulation, wherein the circuit simulation comprises a model for analyzing an sensed signal from the flexible inner conductor of each coaxial probe set and determining a bulk electrical z-resistivity and an interface resistivity of the DUT configured within the sample device.

10. The system of claim 9 , wherein the circuit simulation comprises a Finite Element Method (FEM) simulation.

Assignees

• Lamson Michael Anthony
• Gurrum Siva Prakash
• Dunne Rajiv
• Texas Instruments Inc

Inventors

• Lamson Michael Anthony
• Gurrum Siva Prakash
• Dunne Rajiv

Classifications

• G01R31/2812 Primary

  Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance (of connections G01R31/66) · CPC title

• G01R31/2853

  Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections (G01R31/31717 takes precedence; test of chip-to-PCB or lead-to-PCB connections G01R31/66) · CPC title

• G01R31/2848

  using simulation · CPC title