Chip package method and package assembly
US-2016365257-A1 · Dec 15, 2016 · US
of leadframes
of leadframes · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W70/04 |
| Official title | of leadframes |
| Display label | of leadframes |
| Total patents | 895 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 45 |
| 2016 | 55 |
| 2017 | 73 |
| 2018 | 76 |
| 2019 | 80 |
| 2020 | 104 |
| 2021 | 99 |
| 2022 | 79 |
| 2023 | 107 |
| 2024 | 80 |
| 2025 | 81 |
| 2026 | 16 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Integrated circuit package and method of forming the same
US-9455241-B2 · Sep 27, 2016 · US
Semiconductor package having an isolation wall to reduce electromagnetic coupling
US-9450547-B2 · Sep 20, 2016 · US
Method of manufacturing semiconductor device and semiconductor device
US-2016254214-A1 · Sep 1, 2016 · US
Semiconductor dies with recesses, associated leadframes, and associated systems and methods
US-2016247749-A1 · Aug 25, 2016 · US
Optoelectronic Light-Emitting Component and Leadframe Assemblage
US-2016218248-A1 · Jul 28, 2016 · US
Package in package (PiP) electronic device and manufacturing method thereof
US-9397068-B2 · Jul 19, 2016 · US
Manufacturing method of semiconductor module
US-2016190085-A1 · Jun 30, 2016 · US
Dielectric filmless electronic module and method for manufacturing same
US-2016183377-A1 · Jun 23, 2016 · US
Semiconductor device and manufacturing method thereof
US-2016148895-A1 · May 26, 2016 · US
Packaged device with additive substrate surface modification
US-2016093558-A1 · Mar 31, 2016 · US
Lead frame construct for lead-free solder connections
US-2016064311-A1 · Mar 3, 2016 · US
Semiconductor device and manufacturing method thereof
US-9275940-B2 · Mar 1, 2016 · US
Leadframe and method of manufacturing the same
US-2016056092-A1 · Feb 25, 2016 · US
Method for manufacturing a chip package
US-9245868-B2 · Jan 26, 2016 · US
Integrated circuit packaging system with terminals and method of manufacture thereof
US-9219029-B2 · Dec 22, 2015 · US
Stack frame for electrical connections and the method to fabricate thereof
US-2015348801-A1 · Dec 3, 2015 · US
Package in Package (PiP) Electronic Device and Manufacturing Method thereof
US-2015348934-A1 · Dec 3, 2015 · US
Lead frame with abutment surface
US-9184119-B2 · Nov 10, 2015 · US
Substrate Pad Structure
US-2015318188-A1 · Nov 5, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W70/04?
- CPC H10W70/04 is the Cooperative Patent Classification code for “of leadframes.”
- How many patents are filed under CPC H10W70/04 (of leadframes)?
- Our database includes 895 publications tagged with this CPC code.
- Is patent activity under CPC H10W70/04 growing?
- Publication counts under this code: 80 in 2024 vs 81 in 2025 (latest complete years).