Electroless plating process
US-12416093-B2 · Sep 16, 2025 · US
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Dittler Roy patents
Dittler Roy is listed as an inventor on 13 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Dittler Roy |
| Total patents | 13 |
| First publication | Dec 27, 2018 |
| Latest publication | Sep 16, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Electronic substrates having embedded inductors
US-12159844-B2 · Dec 3, 2024 · US
Method for forming embedded grounding planes on interconnect layers
US-11791228-B2 · Oct 17, 2023 · US
Selective metal deposition by patterning direct electroless metal plating
US-11501967-B2 · Nov 15, 2022 · US
Apparatus with a substrate provided with plasma treatment
US-11291122-B2 · Mar 29, 2022 · US
Electronic substrates having embedded inductors
US-2022093535-A1 · Mar 24, 2022 · US
Electroless plating process
US-2022010452-A1 · Jan 13, 2022 · US
Multiple layer copper seeding
US-2021090946-A1 · Mar 25, 2021 · US
Method for forming embedded grounding planes on interconnect layers
US-2020328131-A1 · Oct 15, 2020 · US
Method for making a flexible wearable circuit
US-10798817-B2 · Oct 6, 2020 · US
Recent patents
Latest publications not already listed above.
Selective metal deposition by patterning direct electroless metal plating
US-2020251332-A1 · Aug 6, 2020 · US
Apparatus with a substrate provided with plasma treatment
US-2020245472-A1 · Jul 30, 2020 · US
Multi-layer flexible/stretchable electronic package for advanced wearable electronics
US-2018376585-A1 · Dec 27, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 13 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/05 | 6 |
| H10W90/724 | 6 |
| H10W70/685 | 4 |
| H10W70/65 | 4 |
| H10W74/15 | 4 |