Process environment for inorganic resist patterning
US-2026072354-A1 · Mar 12, 2026 · US
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De Schepper Peter patents
De Schepper Peter is listed as an inventor on 26 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | De Schepper Peter |
| Total patents | 26 |
| First publication | Aug 13, 2015 |
| Latest publication | Mar 12, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Multiple patterning with organometallic photopatternable layers with intermediate freeze steps
US-12566377-B2 · Mar 3, 2026 · US
Process environment for inorganic resist patterning
US-12498641-B2 · Dec 16, 2025 · US
Stabilized interfaces of inorganic radiation patterning compositions on substrates
US-2025298317-A1 · Sep 25, 2025 · US
Controlled environment processing, rest steps, and baking processes for metal oxide-based resist patterning
US-2025271755-A1 · Aug 28, 2025 · US
Patterned organometallic photoresists and methods of patterning
US-12399426-B2 · Aug 26, 2025 · US
Radical scavenger additives for metal oxide based resists and precursor solutions
US-2025251662-A1 · Aug 7, 2025 · US
Stabilized interfaces of inorganic radiation patterning compositions on substrates
US-12360454-B2 · Jul 15, 2025 · US
Process environment for inorganic resist patterning
US-2025164887-A1 · May 22, 2025 · US
Organometallic radiation patternable coatings with low defectivity and corresponding methods
US-2024369923-A1 · Nov 7, 2024 · US
Recent patents
Latest publications not already listed above.
Organometallic radiation patternable coatings with low defectivity and corresponding methods
US-12072626-B2 · Aug 27, 2024 · US
Process environment for inorganic resist patterning
US-2024272557-A1 · Aug 15, 2024 · US
Multiple patterning with organometallic photopatternable layers with intermediate freeze steps
US-2024118614-A1 · Apr 11, 2024 · US
Process environment for inorganic resist patterning
US-11947262-B2 · Apr 2, 2024 · US
Multiple patterning with organometallic photopatternable layers with intermediate freeze steps
US-11886116-B2 · Jan 30, 2024 · US
High resolution latent image processing, contrast enhancement and thermal development
US-2023100995-A1 · Mar 30, 2023 · US
Patterned organometallic photoresists and methods of patterning
US-2023012169-A1 · Jan 12, 2023 · US
Patterned organometallic photoresists and methods of patterning
US-11480874-B2 · Oct 25, 2022 · US
Organometallic radiation patternable coatings with low defectivity and corresponding methods
US-2022269169-A1 · Aug 25, 2022 · US
Multiple patterning with organometallic photopatternable layers with intermediate freeze steps
US-2021349390-A1 · Nov 11, 2021 · US
Process environment for inorganic resist patterning
US-2021271170-A1 · Sep 2, 2021 · US
Patterned organometallic photoresists and methods of patterning
US-2020124970-A1 · Apr 23, 2020 · US
Method for blocking a trench portion
US-10490442-B2 · Nov 26, 2019 · US
Method for Blocking a Trench Portion
US-2018240699-A1 · Aug 23, 2018 · US
Plasma method for reducing post-lithography line width roughness
US-9520298-B2 · Dec 13, 2016 · US
Plasma Method for Reducing Post-Lithography Line Width Roughness
US-2015228497-A1 · Aug 13, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Inpria Corp | 22 |
| Imec Vzw | 4 |
| Tokyo Electron Ltd | 3 |
| Univ Leuven Kath | 2 |
| Jsr Corp | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G03F7/0042 | 22 |
| G03F7/168 | 12 |
| G03F7/2004 | 11 |
| G03F7/38 | 8 |
| G03F7/322 | 7 |