Broken or folded helical peptide or peptide analog exhibiting antimicrobial activity against gram-negative bacteria, and use thereof
US-11123400-B2 · Sep 21, 2021 · US
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Choi Yunhwa patents
Choi Yunhwa is listed as an inventor on 11 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Choi Yunhwa |
| Total patents | 11 |
| First publication | Jul 20, 2017 |
| Latest publication | Sep 21, 2021 |
Notable patents
Publications ranked by popularity score, then publication date.
Pressing-type semiconductor power device package
US-11056420-B2 · Jul 6, 2021 · US
Semiconductor chip package having heat dissipating structure
US-10438873-B2 · Oct 8, 2019 · US
Pressing-type semiconductor power device package
US-2019259686-A1 · Aug 22, 2019 · US
Clip-bonded semiconductor chip package using metal bumps and method for manufacturing the package
US-10256207-B2 · Apr 9, 2019 · US
Semiconductor chip package having heat dissipating structure
US-10204848-B2 · Feb 12, 2019 · US
Broken or folded helical peptide or peptide analog exhibiting antimicrobial activity against gram-negative bacteria, and use thereof
US-2018339016-A1 · Nov 29, 2018 · US
Clip-bonded semiconductor chip package using metal bumps and method for manufacturing the package
US-2018240770-A1 · Aug 23, 2018 · US
Semiconductor chip package having heat dissipating structure
US-2018233439-A1 · Aug 16, 2018 · US
Semiconductor chip package having heat dissipating structure
US-2018040541-A1 · Feb 8, 2018 · US
Recent patents
Latest publications not already listed above.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Jmj Korea Co Ltd | 9 |
| Seoul Nat Univ R&Db Foundation | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/00 | 7 |
| H10W70/466 | 6 |
| H10W40/778 | 6 |
| H10W90/726 | 5 |
| H10W74/111 | 5 |