Semiconductor device packages and stacked package assemblies including high density interconnections
US-10916429-B2 · Feb 9, 2021 · US
Chen William T is listed as an inventor on 12 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen William T |
| Total patents | 12 |
| First publication | Jul 28, 2016 |
| Latest publication | Feb 9, 2021 |
Publications ranked by popularity score, then publication date.
US-10916429-B2 · Feb 9, 2021 · US
US-10886263-B2 · Jan 5, 2021 · US
US-2020111671-A1 · Apr 9, 2020 · US
US-10535521-B2 · Jan 14, 2020 · US
US-10515806-B2 · Dec 24, 2019 · US
US-2019206684-A1 · Jul 4, 2019 · US
US-2019206683-A1 · Jul 4, 2019 · US
US-10276382-B2 · Apr 30, 2019 · US
US-2019103386-A1 · Apr 4, 2019 · US
US-2019088506-A1 · Mar 21, 2019 · US
Latest publications not already listed above.
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Advanced Semiconductor Eng | 12 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/722 | 12 |
| H10W90/00 | 12 |
| H10W90/724 | 12 |
| H10W72/252 | 12 |
| H10W74/019 | 12 |