Semiconductor device packages and stacked package assemblies including high density interconnections

Patent metadata

Field	Value
Publication number	US-10535521-B2
Application number	US-201916297480-A
Country	US
Kind code	B2
Filing date	Mar 8, 2019
Priority date	Aug 11, 2016
Publication date	Jan 14, 2020
Grant date	Jan 14, 2020

Abstract

A method of forming a semiconductor device package includes: (1) providing an electronic device including an active surface and a contact pad adjacent to the active surface; (2) forming a package body encapsulating portions of the electronic device; and (3) forming a redistribution stack, including: forming a dielectric layer over a front surface of the package body, the dielectric layer defining a first opening exposing at least a portion of the contact pad; and forming a redistribution layer (RDL) over the dielectric layer, the RDL including a first trace, wherein the first trace includes a first portion extending over the dielectric layer along a first longitudinal direction adjacent to the first opening, and a second portion disposed in the first opening and extending between the first portion of the first trace and the exposed portion of the contact pad, wherein the second portion of the first trace has a maximum width along a first transverse direction orthogonal to the first longitudinal direction, and the maximum width of the second portion of the first trace is no greater than 3 times of a width of the first portion of the first trace, wherein the second portion of the first trace is disposed between and spaced from opposing sidewalls of the dielectric layer defining the first opening.

First claim

What is claimed is:

1. A method of forming a semiconductor device package, comprising:
providing an electronic device including an active surface and a contact pad adjacent to the active surface;
forming a package body encapsulating portions of the electronic device; and
forming a redistribution stack, including:
forming a dielectric layer over a front surface of the package body, the dielectric layer defining a first opening exposing at least a portion of the contact pad; and
forming a redistribution layer (RDL) over the dielectric layer, the RDL including a first trace,
wherein the first trace includes a first portion extending over the dielectric layer along a first longitudinal direction adjacent to the first opening, and a second portion disposed in the first opening and extending between the first portion of the first trace and the exposed portion of the contact pad,
wherein the second portion of the first trace has a maximum width along a first transverse direction orthogonal to the first longitudinal direction, and the maximum width of the second portion of the first trace is no greater than 3 times of a width of the first portion of the first trace,
wherein the second portion of the first trace is disposed between and spaced from opposing sidewalls of the dielectric layer defining the first opening.

2. The method of claim 1 , wherein the maximum width of the second portion of the first trace is no greater than 2.5 times of the width of the first portion of the first trace.

3. The method of claim 1 , wherein the maximum width of the second portion of the first trace is substantially the same as the width of the first portion of the first trace.

4. The method of claim 1 , wherein the first opening in the dielectric layer has a maximum width along the first transverse direction, and the maximum width of the second portion of the first trace is less than the maximum width of the first opening.

5. The method of claim 1 , wherein a projection area of the first trace onto the contact pad is no greater than 15% of a total area of the contact pad.

6. The method of claim 1 , wherein the RDL further includes at least two additional traces extending over the dielectric layer and overlapping the contact pad disposed below the additional traces.

7. The method of claim 1 , wherein the package body further includes a back surface opposite to the front surface, the active surface of the electronic device is at least partially exposed from the front surface of the package body, and the redistribution stack is disposed over the front surface of the package body.

8. The method of claim 7 , wherein the electronic device is a first electronic device, the method further comprises providing a second electronic device, the package body encapsulates portions of the second electronic device, and the RDL electrically connects the first electronic device to the second electronic device.

9. The method of claim 7 , wherein the method further comprises providing an interposer component including a lower surface, an upper surface, and a conductive via extending from the lower surface to the upper surface, the package body encapsulates portions of the interposer component, the lower surface of the interposer component is at least partially exposed from the front surface of the package body, the upper surface of the interposer component is at least partially exposed from the back surface of the package body, and the RDL electrically connects the electronic device to the interposer component.

10. The method of claim 9 , wherein the dielectric layer defines a second opening exposing at least a portion of the conductive via, the RDL includes a second trace, the second trace includes a first portion extending over the dielectric layer along a second longitudinal direction adjacent to the second opening, and a second portion disposed in the second opening and extending between the first portion of the second trace and the exposed portion of the conductive via, the second portion of the second trace has a maximum width along a second transverse direction orthogonal to the second longitudinal direction, and the maximum width of the second portion of the second trace is no greater than 3 times of a width of the first portion of the second trace.

11. The method of claim 9 , wherein the redistribution stack is a first redistribution stack, and the method further comprises forming a second redistribution stack disposed over the back surface of the package body.

12. A method of forming a semiconductor device package, comprising:
providing an electronic device including an active surface and a contact pad adjacent to the active surface;
providing a conductive post over the contact pad of the electronic device;
forming a package body encapsulating portions of the electronic device and portions of the conductive post, wherein the package body includes a front surface and a back surface opposite to the front surface, and the conductive post extends between the contact pad of the electronic device and the front surface of the package body; and
forming a redistribution stack, including:
forming a dielectric layer over the front surface of the package body, the dielectric layer defining a first opening exposing at least a portion of a terminal end of the conductive post; and
forming an RDL over the dielectric layer, the RDL including a first trace,
wherein the first trace includes a first portion extending over the dielectric layer, and a second portion disposed in the first opening and extending between the first portion of the first trace and the exposed portion of the terminal end of the conductive post,
wherein the first portion of the first trace extends over the dielectric layer along a longitudinal direction adjacent to the first opening, the second portion of the first trace has a maximum width along a transverse direction orthogonal to the longitudinal direction, and the maximum width of the second portion of the first trace is no greater than 3 times of a width of the first portion of the first trace,
wherein the second portion of the first trace is disposed between and spaced from opposing sidewalls of the dielectric layer defining the first opening.

13. The method of claim 12 , wherein a projection area of the first trace onto the terminal end of the conductive post is no greater than 15% of a total area of the terminal end of the conductive post.

14. The method of claim 12 , wherein a projection area of the first trace onto the terminal end of the conductive post is no greater than 10% of a total area of the terminal end of the conductive post.

15. The method of claim 12 , wherein the RDL further includes at least two additional traces extending over the dielectric layer and overlapping the terminal end of the conductive post disposed below the additional traces.

16. The method of claim 12 , wherein the electronic device is a first electronic device, the method further comprises providing a second electronic device, the package body encapsulates portions of the second electronic device, and the RDL electrically connects the first electronic device to the second electronic device.

17. The method of claim 12 , wherein the conductive post is a first conductive post, the method further comprises providing a second conductive post and an interposer component, the interposer component includes a conductive via, the package body encapsulates portions of the interposer component, the second conductive post extends between the conductive via of the interposer component and the front surface of the package bod

Assignees

• Advanced Semiconductor Eng

Inventors

• Hunt John Richard
• Chen William T
• Hung Chih-Pin
• Wang Chen-Chao

Classifications

• H10W70/63

  Vias, e.g. via plugs · CPC title

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W70/099

  Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers · CPC title

• H10W72/073

  of die-attach connectors · CPC title