Transistor device including enclosed voids below a channel region and methods of forming
US-2026052959-A1 · Feb 19, 2026 · US
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Chen Bomy patents
Chen Bomy is listed as an inventor on 64 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Bomy |
| Total patents | 64 |
| First publication | Jun 25, 2015 |
| Latest publication | Feb 19, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Line of sight display for augmented reality
US-2026039784-A1 · Feb 5, 2026 · US
Multi-process self-cleaning device
US-2026014597-A1 · Jan 15, 2026 · US
Highly integrated environmental sensor
US-2026018551-A1 · Jan 15, 2026 · US
Integrated devices and method for manufacturing same
US-2026013224-A1 · Jan 8, 2026 · US
Sensor including an anodized porous layer and method of forming a sensor
US-2026009774-A1 · Jan 8, 2026 · US
CHIPLET SiP - SECURING SUPPLY CHAIN INTEGRITY WITH SECURE-IP IN INTERPOSER/BRIDGE
US-2026005855-A1 · Jan 1, 2026 · US
Thermal interface material heat transfer antennas
US-2025385158-A1 · Dec 18, 2025 · US
Vapor cells and related systems and methods
US-2025337421-A1 · Oct 30, 2025 · US
Apparatus for controlling vapor pressure of a subject material contained therein, and related methods and systems
US-2025298426-A1 · Sep 25, 2025 · US
Recent patents
Latest publications not already listed above.
Integrated circuit package with heat transfer chimney including thermally conductive nanoparticles
US-12424502-B2 · Sep 23, 2025 · US
HIGH DEFECT SiC WAFER WITH DEVICE LAYER AND METHODS OF MANUFACTURE
US-2025290224-A1 · Sep 18, 2025 · US
High electron mobility transistor and method for manufacturing same
US-2025294794-A1 · Sep 18, 2025 · US
Shielding particles coated with electrical insulation
US-2025285990-A1 · Sep 11, 2025 · US
Vapor cells and related systems and methods
US-12395179-B2 · Aug 19, 2025 · US
High Electron Mobility Transistor and Method for Manufacturing Same
US-2025203900-A1 · Jun 19, 2025 · US
Inductive sensor device with inductor coil formed in redistribution layer (rdl) region
US-2025123125-A1 · Apr 17, 2025 · US
Hybrid semiconductor wafer and method of forming
US-2025112035-A1 · Apr 3, 2025 · US
Integrated circuit bond pad with multi-material toothed structure
US-12205910-B2 · Jan 21, 2025 · US
Interposer with lines having portions separated by barrier layers
US-2024321760-A1 · Sep 26, 2024 · US
Integrated circuit (ic) package including an inductive device formed in a conductive routing region
US-2024282723-A1 · Aug 22, 2024 · US
Integrated circuit (ic) package including a capacitor formed in a conductive routing region
US-2024282740-A1 · Aug 22, 2024 · US
Electronic device including interposers bonded to each other
US-12040282-B2 · Jul 16, 2024 · US
Method for fabricating a patterned fd-soi wafer
US-2024170325-A1 · May 23, 2024 · US
Integrated circuit package module including a bonding system
US-11935824-B2 · Mar 19, 2024 · US
Vapor cells and related systems and methods
US-2023421163-A1 · Dec 28, 2023 · US
Vapor cells and related systems and methods
US-11764796-B2 · Sep 19, 2023 · US
Integrated circuit package with backside lead for clock tree or power distribution network circuits
US-2023290765-A1 · Sep 14, 2023 · US
Integrated circuit (IC) package with integrated inductor having core magnetic field (B field) extending parallel to substrate
US-11723222-B2 · Aug 8, 2023 · US
Integrated circuit bond pad with multi-material toothed structure
US-11682641-B2 · Jun 20, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Microchip Tech Inc | 61 |
| Silicon Storage Tech Inc | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 18 |
| H10W72/952 | 15 |
| H10W90/724 | 15 |
| H10W72/923 | 13 |
| H10W70/611 | 12 |