Electronic device including interposers bonded to each other

Patent metadata

Field	Value
Publication number	US-12040282-B2
Application number	US-202217667275-A
Country	US
Kind code	B2
Filing date	Feb 8, 2022
Priority date	Oct 1, 2021
Publication date	Jul 16, 2024
Grant date	Jul 16, 2024

Abstract

An electronic device includes a first interposer, a first integrated circuit (IC) device affixed to the first interposer, a second interposer, and a second IC device affixed to the second interposer. he second interposer is bonded to the first interposer. The first interposer includes first interposer circuitry and a first connection element electrically connected to the first interposer circuitry. The second interposer includes second interposer circuitry and a second connection element electrically connected to the second interposer circuitry. The second connection element is bonded to the first connection element to define a connection element pair. The connection element pair provides an electrical connection between the first interposer circuitry and the second interposer circuitry.

First claim

The invention claimed is:

1. An electronic device, comprising:
a first interposer including:
first interposer circuitry; and
a first connection element electrically connected to the first interposer circuitry:

a first integrated circuit (IC) device affixed to the first interposer;
a second interposer bonded to the first interposer and including:
second interposer circuitry; and
a second connection element electrically connected to the second interposer circuitry;

a second IC device affixed to the second interposer;
wherein the second connection element is bonded to the first connection element to define a connection element pair;
wherein the connection element pair provides an electrical connection between the first interposer circuitry and the second interposer; and
wherein the first connection element is a multi-component bonding element including (a) a conduction component formed from a first metal and (b) a bonding component formed from a second metal different than the first metal, wherein both the conduction component and the bonding component of the first connection element are in direct contact with the second connection element.

2. The electronic device of claim 1 , wherein:
the first IC device includes first IC device circuitry;
the second IC device includes second IC device circuitry; and
the first IC device circuitry is electrically connected to the second IC device circuitry via the first interposer circuitry, the connection element pair, and the second interposer circuitry.

3. The electronic device of claim 1 , wherein the first interposer, the second interposer, the first IC device, and the second IC device are part of an IC package;
wherein the IC package is mounted to a package mounting substrate.

4. The electronic device of claim 3 , wherein the package mounting substrate comprises a printed circuit board (PCB).

5. The electronic device of claim 3 , wherein:
the IC package includes a chip carrier;
the first interposer, the second interposer, the first IC device and the second IC device are part of a stacked IC device assembly, the stacked IC device assembly part of the IC package;
the stacked IC device assembly is affixed to the chip carrier; and
the chip carrier is mounted to the package mounting substrate.

6. The electronic device of claim 5 , wherein the chip carrier comprises a copper clip or a lead frame.

7. The electronic device of claim 5 , wherein:
the first interposer circuitry includes an IC package contact;
the second interposer circuitry is electrically connected to the IC package contact via the connection element pair; and
the IC package includes a first wire bond connection between the IC package contact and the chip carrier.

8. The electronic device of claim 1 , wherein:
the first metal has a first melting point; and
the second metal has a second melting point, the second melting point lower than the first melting point.

9. The electronic device of claim 1 , wherein:
the first metal comprises copper, silver, or gold; and
the second metal comprises tin, indium, a tin alloy, or an indium alloy.

10. The electronic device of claim 1 , wherein:
the second connection element comprises a second multi-component bonding element including:
a second conduction component formed from a third metal; and
a second first bonding component formed from a fourth metal different than the third metal.

11. The electronic device of claim 10 , wherein:
the first metal and the third metal comprise the same metal; and
the second metal and the fourth metal comprise the same metal.

12. An electronic device, comprising:
an integrated circuit (IC) package, including:
a first interposer including:
first interposer circuitry; and
a first connection element electrically connected to the first interposer circuitry:

a first IC device affixed to the first interposer;
a second interposer bonded to the first interposer and including:
second interposer circuitry; and
a second connection element electrically connected to the second interposer circuitry;

a second IC device affixed to the second interposer;
wherein the second connection element is bonded to the first connection element to define a connection element pair;
wherein the connection element pair provides an electrical connection between the first interposer circuitry and the second interposer; and

a printed circuit board (PCB) oriented in a first plane, the PCB including:
a PCB slot; and
PCB circuitry electrically connected to the PCB slot;

wherein the IC package is mounted in the PCB slot in an orientation orthogonal to the first plane.

13. The electronic device of claim 12 , wherein:
the first interposer includes a first contact electrically connected to a first IC device circuitry of the first IC device;
the second interposer includes a second contact electrically connected to a second IC device circuitry of the second IC device;
the PCB slot includes a first PCB slot contact and a second PCB slot contact;
the first contact of the first interposer is electrically connected to the first PCB slot contact; and
the second contact of the second interposer is electrically connected to the second PCB slot contact.

14. The electronic device of claim 13 , wherein:
the first contact of the first interposer comprises a first wire-bond pad or a first pin-out contact on the first interposer; and
the second contact of the second interposer comprises a second wire-bond pad or a second pin-out contact on the second interposer.

15. An electronic device, comprising:
an integrated circuit (IC) package including:
a chip carrier;
a first interposer assembly including:
a first interposer;
a first IC device affixed to the first interposer; and

a second IC interposer assembly including:
a second interposer; and
a second IC device affixed to the second interposer;

wherein the first interposer is bonded to the second interposer with the first interposer and the second interposer arranged between the first IC device and the second IC device; and
wherein the IC package is mounted on a mounting portion of the chip carrier; and

a package mounting substrate;
wherein the chip carrier is affixed to the package mounting substrate to mount the IC package on the package mounting substrate; and
wherein the mounting portion of the chip carrier is physically spaced apart from the package mounting substrate, so that the IC package is physically spaced apart from the package mounting substrate to decouple a coefficient of thermal expansion (CTE) mismatch between the IC package and the package mounting substrate.

16. The electronic device of claim 15 , wherein the package mounting substrate comprises a printed circuit board.

17. The electronic device of claim 15 , wherein the chip carrier comprises a copper clip or a lead frame.

18. The electronic device of claim 15 , wherein:
the first interposer includes including an IC package contact; and
the IC package includes a wire bond connection between the IC package contact and the chip carrier.

19. The electronic device of claim 15 , wherein:
the first interposer includes a first connection element;
the second interposer includes a second connection element bonded to the first connection element; and
at least one of the first connection element and the second connection element comprises a multi-component bonding element including:
a conduction component formed from a first metal; and
a bonding component formed from a second metal different

Assignees

• Microchip Tech Inc

Inventors

• Sato Justin
• Chen Bomy
• Ramamurthy Anu
• Kovats Julius

Classifications

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title

• H10W90/291

  characterised by containers, encapsulations, or other housings for the stacked chips · CPC title