Integrated circuit package with heat transfer chimney including thermally conductive nanoparticles

Patent metadata

Field	Value
Publication number	US-12424502-B2
Application number	US-202217889760-A
Country	US
Kind code	B2
Filing date	Aug 17, 2022
Priority date	Aug 18, 2021
Publication date	Sep 23, 2025
Grant date	Sep 23, 2025

Abstract

An electronic device includes an integrated circuit package including a die mounted on a die carrier, a mold structure at least partially encapsulating the mounted die, and a heat transfer chimney formed on the die. The heat transfer chimney extends at least partially through the mold structure to transfer heat away from the die. The heat transfer chimney is formed from a thermally conductive compound including thermally conductive nanoparticles.

First claim

The invention claimed is:

1. An electronic device, comprising:
an integrated circuit package comprising:
a die mounted on a die carrier;
a mold structure at least partially encapsulating the mounted die; and
a heat transfer chimney formed on the die and extending at least partially through the mold structure to transfer heat away from the die;
wherein the heat transfer chimney is formed from a thermally conductive compound including thermally conductive nanoparticles dispersed in an epoxy or other polymer base.

2. The electronic device of claim 1 , wherein the heat transfer chimney extends through a full thickness of the mold structure, wherein a distal surface of the heat transfer chimney is exposed through an outer surface of the mold structure.

3. The electronic device of claim 1 , wherein the die carrier comprises a lead frame or an interposer.

4. The electronic device of claim 1 , wherein the thermally conductive nanoparticles comprise at least one of diamond nanoparticles, silicon carbide nanoparticles, boron nitride nanoparticles, hexagonal boron nitride nanoparticles, or boron nitride nanotubes.

5. The electronic device of claim 1 , wherein the thermally conductive compound including thermally conductive nanoparticles dispersed in a polymer resin.

6. The electronic device of claim 1 , wherein the thermally conductive compound includes thermally conductive nanoparticles and silica dispersed in an epoxy resin.

7. The electronic device of claim 1 , wherein the mold structure includes at least one of magnetic shielding nanoparticles to shield the die from magnetic fields or radiation shielding nanoparticles to shield the die from ionic radiation.

8. An electronic device, comprising:
an integrated circuit package comprising:
a die mounted on a die carrier;
a mold structure at least partially encapsulating the mounted die; and
a heat transfer chimney formed on the die and extending at least partially through the mold structure to transfer heat away from the die;
wherein the heat transfer chimney is formed from a thermally conductive compound including thermally conductive nanoparticles; and
wherein the mold structure includes shielding nanoparticles to protect the die, the shielding nanoparticles including at least one of (a) magnetic shielding nanoparticles to shield the die from magnetic fields or radiation shielding nanoparticles to shield the die from ionic radiation.

9. The electronic device of claim 8 , wherein the mold structure includes magnetic shielding nanoparticles comprising at least one of mu-metal or hematite (Fe 2 O 3 ).

10. The electronic device of claim 8 , wherein the shielding nanoparticles comprise at least one of boron nitride (BN), bismuth (Bi), bismuth oxide (Bi 2 O 3 ), tantalum nitride (TaN), tungsten nitride (W 3 N 2 ), tin oxide (SnO 2 ), copper (I) oxide (Cu 2 O), or copper (II) oxide (CuO).

11. The electronic device of claim 8 , comprising a shielding layer formed over the mold structure, the shielding layer including at least one of (a) magnetic shielding nanoparticles to shield the die from magnetic fields or (b) radiation shielding nanoparticles to shield the die from ionizing radiation.

12. The electronic device of claim 8 , comprising a multi-layer shield formed over the mold structure, wherein the multi-layer shield includes multiple different shielding layers, wherein respective shielding layers of the multiple different shielding layers include shielding nanoparticles to shield the die from at least one of magnetic fields or ionizing radiation, wherein the multiple different shielding layers include different types or different concentrations of shielding nanoparticles.

13. The electronic device of claim 12 , wherein the different types or different concentrations of shielding nanoparticles in the multiple different shielding layers of the multi-layer shield defines a shielding gradient.

14. The electronic device of claim 8 , wherein:
the integrated circuit package is mounted on a first side of a package support structure; and
the electronic device includes a back-side shielding layer formed on a second side of the package support structure opposite the first side, the back-side shielding layer including shielding nanoparticles to shield the die from at least one of magnetic fields or ionizing radiation.

15. A method, comprising:
forming an integrated circuit package, including:
mounting a die on a die carrier;
forming a thermally conductive compound, including mixing thermally conductive nanoparticles with an epoxy or other polymer base;
forming a heat transfer chimney on the die from the thermally conductive compound; and
forming a mold structure at least partially encapsulating the die;
wherein the heat transfer chimney extends at least partially through the mold structure; and
wherein the heat transfer chimney includes thermally conductive nanoparticles to transfer heat away from the die.

16. The method of claim 15 , wherein forming the thermally conductive compound includes mixing (a) silica particles and (b) the thermally conductive nanoparticles with a polymer.

17. The method of claim 15 , wherein forming the thermally conductive compound includes:
mixing a surfactant with the thermally conductive nanoparticles to form surfactant-coated thermally conductive nanoparticles; and
mixing the surfactant-coated thermally conductive nanoparticles with a polymer.

18. The method of claim 15 , wherein forming the thermally conductive compound includes:
mixing a surfactant with the thermally conductive nanoparticles to form surfactant-coated thermally conductive nanoparticles; and
mixing (a) the surfactant-coated thermally conductive nanoparticles and (b) silica filler with an epoxy.

19. The method of claim 15 , wherein forming the thermally conductive compound includes mixing silica particles and thermally conductive nanoparticles with an epoxy resin, wherein the thermally conductive nanoparticles comprise diamond nanoparticles, silicon carbide nanoparticles, boron nitride nanoparticles, hexagonal boron nitride nanoparticles, or boron nitride nanotubes.

20. The method of claim 15 , wherein forming the heat transfer chimney on the die comprises printing the heat transfer chimney using an additive printing process.

21. A method, comprising:
forming an integrated circuit package, including:
mounting a die on a die carrier;
forming a heat transfer chimney on the die;
mixing shielding nanoparticles with a mold compound to form a nanoparticle-enhanced mold compound; and
forming a mold structure at least partially encapsulating the die from the nanoparticle-enhanced mold compound
wherein the heat transfer chimney extends at least partially through the mold structure; and
wherein the heat transfer chimney includes thermally conductive nanoparticles to transfer heat away from the die.

22. The method of claim 21 , comprising forming a shielding layer over the mold structure, the shielding layer including at least one of (a) magnetic shielding nanoparticles to shield the die from magnetic fields or (b) radiation shielding nanoparticles to shield the die from ionizing radiation.

23. The method of claim 21 , comprising forming multiple different shielding layers over the mold structure, wherein respective shielding layers of the multiple different shielding layers include shielding nanoparticles to shield the die from at least one of magnetic fields or ionizing radiation, wherein the multip

Assignees

• Microchip Tech Inc

Inventors

• Chen Bomy
• Sato Justin

Classifications

• H10W90/755

  between a chip and a laterally-adjacent insulating package substrate, interpose or RDL · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/288

  characterised by arrangements for thermal management of the stacked chips · CPC title