Inductive sensor device with inductor coil formed in redistribution layer (rdl) region

Patent metadata

Field	Value
Publication number	US-2025123125-A1
Application number	US-202418413114-A
Country	US
Kind code	A1
Filing date	Jan 16, 2024
Priority date	Oct 11, 2023
Publication date	Apr 17, 2025
Grant date	—

Abstract

An inductive sensor device includes at least one die mounted in or on a substrate, a redistribution layer (RDL) region formed over the at least one die and including multiple RDL metal layers, and at least one inductive coil formed in the RDL region and including at least one conductive coil element formed in at least one RDL metal layer of the multiple RDL metal layers, wherein the at least one die includes sensor circuitry connected to the at least one inductive coil to perform sensor measurements.

First claim

1 . An inductive sensor device, comprising:
at least one die mounted in or on a substrate; a redistribution layer (RDL) region formed over the at least one die, the RDL region including multiple RDL metal layers; and at least one inductive coil formed in the RDL region, the at least one inductive coil including at least one conductive coil element formed in at least one RDL metal layer of the multiple RDL metal layers; wherein the at least one die includes a sensor circuitry connected to the at least one inductive coil to perform sensor measurements.

2 . The inductive sensor device of claim 1 , wherein the at least one inductive coil includes respective conductive coil elements formed in at least two RDL metal layers of the multiple RDL metal layers.

3 . The inductive sensor device of claim 1 , comprising multiple conductive signal routing elements formed in the RDL region, wherein (a) a respective conductive coil element of the at least one conductive coil element and (b) a respective conductive signal routing element of the multiple conductive signal routing elements are formed in a common RDL metal layer of the multiple RDL metal layers.

4 . The inductive sensor device of claim 1 , wherein:
the at least one inductive coil includes a primary coil and at least one secondary coil; and the sensor circuitry includes:
an oscillator connected to the primary coil to generate a magnetic field from the primary coil; and
a voltage detection circuitry connected to the at least one secondary coil to detect voltages at the at least one secondary coil.

5 . The inductive sensor device of claim 4 , wherein:
the at least one secondary coil includes a first secondary coil and a second secondary coil; and the voltage detection circuitry is connected to the first secondary coil and the second secondary coil to detect a first voltage at the first secondary coil and a second voltage at the second secondary coil, and to calculate a ratio of the first voltage to the second voltage.

6 . The inductive sensor device of claim 4 , wherein:
the primary coil includes at least one primary coil element is formed in a first RDL metal layer of the multiple RDL metal layers; the first secondary coil includes at least one first secondary coil element formed in a second RDL metal layer of the multiple RDL metal layers; and the second secondary includes at least one second secondary coil element formed in a third RDL metal layer of the multiple RDL metal layers.

7 . The inductive sensor device of claim 4 , wherein the inductive sensor device comprises a linear position sensor.

8 . The inductive sensor device of claim 4 , wherein the inductive sensor device comprises a rotation sensor.

9 . The inductive sensor device of claim 1 , wherein the inductive sensor device is formed as a system-in-package (SiP) including the at least one die mounted in or on the substrate, the RDL region, and the at least one inductive coil formed in the RDL region.

10 . The inductive sensor device of claim 1 , wherein the at least one die includes a first die and a second die; and
the RDL region includes at least one conductive routing element defining a conductive connection between the first die and the second die.

11 . The inductive sensor device of claim 1 , wherein the at least one die includes an analog die and a digital die.

12 . The inductive sensor device of claim 1 , comprising an antenna including an antenna coil including at least one conductive coil element formed in the RDL region.

13 . A method, comprising:
arranging at least one die on a carrier, the at least one die including sensor circuitry; depositing an encapsulant over the at least one die to form a substrate supporting the at least one die; and forming a redistribution layer (RDL) region including multiple RDL metal layers over the at least one die, wherein forming the RDL region includes forming at least one inductive coil including at least one conductive coil element in at least one RDL metal layer of the multiple RDL metal layers; and wherein the at least one inductive coil is connected to the sensor circuitry in the at least one die.

14 . The method of claim 13 , wherein forming the RDL region including multiple RDL metal layers includes forming multiple RDL metal layers alternating with multiple RDL via layers, and forming respective conductive coil elements of the at least one inductive coil includes forming respective conductive coil elements in at least two respective RDL metal layers of the multiple RDL metal layers.

15 . The method of claim 13 , comprising forming multiple conductive signal routing elements in the RDL region, wherein (a) a respective conductive coil element of the at least one conductive coil element and (b) a respective conductive signal routing element of the multiple conductive signal routing elements are formed in a common RDL metal layer of the multiple RDL metal layers.

16 . The method of claim 13 , wherein forming the at least one inductive coil includes (a) forming a primary coil in a respective RDL metal layer of the multiple RDL metal layers and (b) forming at least one secondary coil in at least one other respective RDL metal layer of the multiple RDL metal layers.

17 . The method of claim 13 , wherein forming the at least one inductive coil including at least one conductive coil element in at least one RDL metal layer of the multiple RDL metal layers includes:
forming at least one primary coil element of a primary coil in a first RDL metal layer; forming at least one first secondary coil element of a first secondary coil in a second RDL metal layer; and forming at least one second secondary coil element of a second secondary in a third RDL metal layer.

18 . The method of claim 13 , wherein the at least one die includes a first die and a second die; and
the method includes forming at least one conductive routing element in the RDL region to conductively connect the first die to the second die.

19 . An inductive sensor device, comprising:
at least one die mounted in or on a substrate; a redistribution layer (RDL) region formed over the at least one die, the RDL region including multiple RDL metal layers; a primary coil including a primary coil element formed in a first RDL metal layer of the multiple RDL metal layers; a first secondary coil including a first secondary coil element formed in a second RDL metal layer of the multiple RDL metal layers; and a second secondary coil including a second secondary coil element formed in a third RDL metal layer of the multiple RDL metal layers; wherein the at least one die includes sensor circuitry connected to the primary coil, the first secondary coil, and the second secondary coil.

20 . The inductive sensor device of claim 19 , wherein the sensor circuitry includes:
an oscillator to generate a magnetic field from the primary coil; and a voltage detection circuitry to:
detect a first voltage at the first secondary coil and a second voltage at the second secondary coil;
calculate a ratio of the first voltage to the second voltage; and
determine a position or movement of a target object based at least on the calculated ratio of the first voltage to the second voltage.

Assignees

• Microchip Tech Inc

Inventors

• Ramamurthy Anu
• Smith Kevin Mark
• Chen Bomy

Classifications

• G01D5/20 Primary

  by varying inductance, e.g. by a movable armature · CPC title

• G01B7/30 Primary

  for measuring angles or tapers; for testing the alignment of axes · CPC title