Semiconductor structure with capping member containing oxynitride layer and method of manufacturing thereof
US-2026096470-A1 · Apr 2, 2026 · US
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Chang Jen-Yuan patents
Chang Jen-Yuan is listed as an inventor on 326 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chang Jen-Yuan |
| Total patents | 326 |
| First publication | Jun 11, 2015 |
| Latest publication | Apr 2, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor die, semiconductor package and manufacturing method of semiconductor die
US-2026090367-A1 · Mar 26, 2026 · US
Soic novel structure for inner die edge protection layer
US-2026090386-A1 · Mar 26, 2026 · US
Inner die having esd protection device in 3d packaging
US-2026090391-A1 · Mar 26, 2026 · US
Semiconductor structure having deep trench capacitor and method of manufacturing thereof
US-12575414-B2 · Mar 10, 2026 · US
Semiconductor package with active thermal management
US-2026068670-A1 · Mar 5, 2026 · US
Semiconductor package with active thermal management lid
US-2026060084-A1 · Feb 26, 2026 · US
Bonded die structures with reduced crack defects and methods of forming the same
US-2026060022-A1 · Feb 26, 2026 · US
Semiconductor device with through substrate conductive pillars having different cross-sectional areas and method of making
US-12564033-B2 · Feb 24, 2026 · US
Hybrid bonding using stress-relief dummy pads and methods of forming and using the same
US-2026052992-A1 · Feb 19, 2026 · US
Recent patents
Latest publications not already listed above.
Semiconductor device and method of manufacturing the same
US-2026053062-A1 · Feb 19, 2026 · US
Bonded die structures with improved die positioning and methods for forming the same
US-2026053001-A1 · Feb 19, 2026 · US
Semiconductor device and methods of making the same
US-2026052982-A1 · Feb 19, 2026 · US
High-efficiency inner air purge design for frame cassettes for semiconductor manufacturing
US-2026052939-A1 · Feb 19, 2026 · US
Semiconductor structure and manufacturing method thereof
US-2026053051-A1 · Feb 19, 2026 · US
Semiconductor structure including bonding conductor having protruding portion
US-2026052974-A1 · Feb 19, 2026 · US
Semiconductor package device and method for manufacturing the same
US-12557687-B2 · Feb 17, 2026 · US
Bonded die structures with improved bonding and methods of forming the same
US-2026047463-A1 · Feb 12, 2026 · US
Surface inspection tool for transfer tools and methods of using the same
US-2026036526-A1 · Feb 5, 2026 · US
Semiconductor package including semiconductor dies having different lattice directions and method of forming the same
US-12543593-B2 · Feb 3, 2026 · US
Active contact pressure control wheel structure and vehicle
US-2026027858-A1 · Jan 29, 2026 · US
Semiconductor package including semiconductor dies having different lattice directions and method of forming the same
US-12538850-B2 · Jan 27, 2026 · US
Semiconductor package including SoIC die stacks
US-12532776-B2 · Jan 20, 2026 · US
Method of performing inter-site backup processing of wafer lots
US-12529567-B2 · Jan 20, 2026 · US
Nozzle with support structures for use in a pick-and-place machine and methods of using the same
US-2026014713-A1 · Jan 15, 2026 · US
Semiconductor structure with capping member containing oxynitride layer and method of manufacturing thereof
US-12519026-B2 · Jan 6, 2026 · US
Semiconductor die packages and methods of formation
US-2026005166-A1 · Jan 1, 2026 · US
Semiconductor die packages including non-active dies and methods of formation
US-2026005117-A1 · Jan 1, 2026 · US
Pick-and-place system with a stabilizer
US-2025364297-A1 · Nov 27, 2025 · US
Magnetic reaction wheel operating method and magnetic reaction wheel
US-2025361035-A1 · Nov 27, 2025 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 293 |
| Univ Nat Tsing Hua | 18 |
| Inventec Pudong Tech Corp | 7 |
| Inventec Corp | 7 |
| Ind Tech Res Inst | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 207 |
| H10W90/297 | 141 |
| H10W90/792 | 132 |
| H10W42/00 | 108 |
| H10W80/00 | 98 |