Method of forming an electrical connection and electrical connection
US-2025385220-A1 · Dec 18, 2025 · US
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Cha Chan Lam patents
Cha Chan Lam is listed as an inventor on 24 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Cha Chan Lam |
| Total patents | 24 |
| First publication | Jan 12, 2017 |
| Latest publication | Dec 18, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Methods for Manufacturing Semiconductor Packages
US-2025266311-A1 · Aug 21, 2025 · US
Chip package and method of forming a chip package
US-2025210478-A1 · Jun 26, 2025 · US
Semiconductor packages and methods for manufacturing thereof
US-12300559-B2 · May 13, 2025 · US
Molded power die package with vertical interconnect
US-2025140734-A1 · May 1, 2025 · US
Chip package and method of forming a chip package
US-12278171-B2 · Apr 15, 2025 · US
Semiconductor package with metal posts from structured leadframe
US-12176222-B2 · Dec 24, 2024 · US
Semiconductor package interconnect and power connection by metallized structures on package body
US-2023197585-A1 · Jun 22, 2023 · US
Chip package and method of forming a chip package
US-2023197586-A1 · Jun 22, 2023 · US
Semiconductor package with metal posts from structured leadframe
US-2023170226-A1 · Jun 1, 2023 · US
Recent patents
Latest publications not already listed above.
Semiconductor package with metal posts from structured leadframe
US-2023170329-A1 · Jun 1, 2023 · US
Lead frame-based semiconductor package
US-11469161-B2 · Oct 11, 2022 · US
Method for connecting an electrical device to a bottom unit by using a solderless joint
US-2022278085-A1 · Sep 1, 2022 · US
Semiconductor Packages and Methods for Manufacturing Thereof
US-2022199478-A1 · Jun 23, 2022 · US
Pressure sensor having a lidless/laminate structure
US-11274984-B2 · Mar 15, 2022 · US
Lead frame-based semiconductor package
US-2022068773-A1 · Mar 3, 2022 · US
Quad package with conductive clips connected to terminals at upper surface of semiconductor die
US-11217511-B2 · Jan 4, 2022 · US
Semiconductor device with bond pad extensions formed on molded appendage
US-11081455-B2 · Aug 3, 2021 · US
Pressure Sensor
US-2021025774-A1 · Jan 28, 2021 · US
Semiconductor Device with Bond Pad Extensions Formed on Molded Appendage
US-2020343205-A1 · Oct 29, 2020 · US
Quad Package with Conductive Clips Connected to Terminals at Upper Surface of Semiconductor Die
US-2020328140-A1 · Oct 15, 2020 · US
Multi-phase half bridge driver package and methods of manufacture
US-10396018-B2 · Aug 27, 2019 · US
Multi-Phase Half Bridge Driver Package and Methods of Manufacture
US-2019164873-A1 · May 30, 2019 · US
Lead frame including u-notch
US-2017011989-A1 · Jan 12, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 21 |
| Infineon Technologies Austria Ag | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/111 | 20 |
| H10W72/075 | 15 |
| H10W74/01 | 15 |
| H10W70/421 | 15 |
| H01L21/56 | 12 |