Integrated circuit packages including a high thermal conductivity material in 3 dimensional die stacks
US-2026090450-A1 · Mar 26, 2026 · US
Brezinski William is listed as an inventor on 16 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Brezinski William |
| Total patents | 16 |
| First publication | Nov 14, 2019 |
| Latest publication | Mar 26, 2026 |
Publications ranked by popularity score, then publication date.
US-2026090450-A1 · Mar 26, 2026 · US
US-2025112155-A1 · Apr 3, 2025 · US
US-11887887-B2 · Jan 30, 2024 · US
US-11846032-B2 · Dec 19, 2023 · US
US-11784123-B2 · Oct 10, 2023 · US
US-11649548-B2 · May 16, 2023 · US
US-11532558-B2 · Dec 20, 2022 · US
US-2022336267-A1 · Oct 20, 2022 · US
US-11404307-B2 · Aug 2, 2022 · US
US-2022181251-A1 · Jun 9, 2022 · US
Latest publications not already listed above.
US-11289421-B2 · Mar 29, 2022 · US
US-2021098387-A1 · Apr 1, 2021 · US
US-2021098359-A1 · Apr 1, 2021 · US
US-2021098360-A1 · Apr 1, 2021 · US
US-2020299848-A1 · Sep 24, 2020 · US
US-2019345618-A1 · Nov 14, 2019 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 12 |
| Univ Arizona | 4 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 12 |
| H10W90/792 | 12 |
| H10W72/952 | 11 |
| H10W72/923 | 11 |
| H10W80/312 | 11 |