Methods of splitting a semiconductor work piece
US-12528143-B2 · Jan 20, 2026 · US
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Binter Alexander patents
Binter Alexander is listed as an inventor on 13 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Binter Alexander |
| Total patents | 13 |
| First publication | Sep 14, 2017 |
| Latest publication | Jan 20, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of processing a semiconductor wafer
US-2025183031-A1 · Jun 5, 2025 · US
Parent Substrate, Wafer Composite and Methods of Manufacturing Crystalline Substrates and Semiconductor Devices
US-2023330769-A1 · Oct 19, 2023 · US
Parent substrate, wafer composite and methods of manufacturing crystalline substrates and semiconductor devices
US-11712749-B2 · Aug 1, 2023 · US
Manufacturing and reuse of semiconductor substrates
US-2023127556-A1 · Apr 27, 2023 · US
Methods of splitting a semiconductor work piece
US-2022339740-A1 · Oct 27, 2022 · US
Parent Substrate, Wafer Composite and Methods of Manufacturing Crystalline Substrates and Semiconductor Devices
US-2021053148-A1 · Feb 25, 2021 · US
Forming recombination centers in a semiconductor device
US-10347491-B2 · Jul 9, 2019 · US
Method for providing a planarizable workpiece support, a workpiece planarization arrangement, and a chuck
US-10199255-B2 · Feb 5, 2019 · US
Forming Recombination Centers in a Semiconductor Device
US-2018182629-A1 · Jun 28, 2018 · US
Recent patents
Latest publications not already listed above.
Method for planarizing one or more workpieces, a workpiece planarization arrangement, a chuck and a replaceable workpiece-support for a chuck
US-9862037-B2 · Jan 9, 2018 · US
Method for providing a planarizable workpiece support, a workpiece planarization arrangement, and a chuck
US-2017263490-A1 · Sep 14, 2017 · US
Method for planarizing one or more workpieces, a workpiece planarization arrangement, a chuck and a replaceable workpiece-support for a chuck
US-2017259354-A1 · Sep 14, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 12 |
| Infineon Technologies Austria Ag | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P52/00 | 7 |
| H10P95/112 | 5 |
| B23K26/0624 | 5 |
| H10P95/11 | 4 |
| H10P50/00 | 4 |