Semiconductor substrate
US-2024105512-A1 · Mar 28, 2024 · US
leaving a reusable substrate, e.g. epitaxial lift off
leaving a reusable substrate, e.g. epitaxial lift off · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P95/112 |
| Official title | {leaving a reusable substrate, e.g. epitaxial lift off} |
| Display label | leaving a reusable substrate, e.g. epitaxial lift off |
| Total patents | 433 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 38 |
| 2016 | 36 |
| 2017 | 46 |
| 2018 | 39 |
| 2019 | 38 |
| 2020 | 35 |
| 2021 | 44 |
| 2022 | 36 |
| 2023 | 48 |
| 2024 | 34 |
| 2025 | 34 |
| 2026 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Apparatus and method for separating a stacked arrangement
US-9522521-B2 · Dec 20, 2016 · US
Systems and methods for laser splitting and device layer transfer
US-2016336233-A1 · Nov 17, 2016 · US
Semiconductor die singulation method
US-9484210-B2 · Nov 1, 2016 · US
Method for the reuse of gallium nitride epitaxial substrates
US-2016307801-A1 · Oct 20, 2016 · US
Display device
US-9472772-B2 · Oct 18, 2016 · US
Systems and methods for separating components of a multilayer stack of electronic components
US-9458550-B2 · Oct 4, 2016 · US
Spalling using dissolvable release layer
US-2016284554-A1 · Sep 29, 2016 · US
Controlled spalling of fine features
US-9455180-B1 · Sep 27, 2016 · US
Method for producing flexible display panel
US-2016248012-A1 · Aug 25, 2016 · US
Method for the reuse of gallium nitride epitaxial substrates
US-9396943-B2 · Jul 19, 2016 · US
Peeling apparatus and manufacturing apparatus of semiconductor device
US-9397126-B2 · Jul 19, 2016 · US
Embrittlement device, pick-up system and method of picking up chips
US-2016204017-A1 · Jul 14, 2016 · US
Epitaxial lift off systems and methods
US-9381731-B2 · Jul 5, 2016 · US
Polarization induced doped transistor
US-9362389-B2 · Jun 7, 2016 · US
Conductivity based on selective etch for gan devices and applications thereof
US-2016153113-A1 · Jun 2, 2016 · US
Release strategies for making transferable semiconductor structures, devices and device components
US-9349900-B2 · May 24, 2016 · US
Integrated solar collectors using epitaxial lift off and cold weld bonded semiconductor solar cells
US-2016141431-A1 · May 19, 2016 · US
Controlled spalling using a reactive material stack
US-9324566-B1 · Apr 26, 2016 · US
Active Device Substrate and Display Device
US-2016079550-A1 · Mar 17, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P95/112?
- CPC H10P95/112 is the Cooperative Patent Classification code for “leaving a reusable substrate, e.g. epitaxial lift off.”
- How many patents are filed under CPC H10P95/112 (leaving a reusable substrate, e.g. epitaxial lift off)?
- Our database includes 433 publications tagged with this CPC code.
- Is patent activity under CPC H10P95/112 growing?
- Publication counts under this code: 34 in 2024 vs 34 in 2025 (latest complete years).