Selective patterning of vias with hardmasks
US-12243771-B2 · Mar 4, 2025 · US
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Arnold John C patents
Arnold John C is listed as an inventor on 35 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Arnold John C |
| Total patents | 35 |
| First publication | Aug 6, 2015 |
| Latest publication | Mar 4, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for fabricating a semiconductor device including self-aligned top via formation at line ends
US-11404317-B2 · Aug 2, 2022 · US
Selective patterning of vias with hardmasks
US-2022165612-A1 · May 26, 2022 · US
Selective patterning of vias with hardmasks
US-11276607-B2 · Mar 15, 2022 · US
Alternating hardmasks for tight-pitch line formation
US-11171002-B2 · Nov 9, 2021 · US
Self-aligned top via
US-11133260-B2 · Sep 28, 2021 · US
Self-aligned top via
US-2021151377-A1 · May 20, 2021 · US
Self-aligned top via formation at line ends
US-2021090951-A1 · Mar 25, 2021 · US
Multi-layer encapsulation to enable endpoint-based process control for embedded memory fabrication
US-10957850-B2 · Mar 23, 2021 · US
Selective patterning of vias with hardmasks
US-2021082746-A1 · Mar 18, 2021 · US
Recent patents
Latest publications not already listed above.
Extreme ultraviolet lithography for high volume manufacture of a semiconductor device
US-10879068-B2 · Dec 29, 2020 · US
Formation of embedded magnetic random-access memory devices with multi-level bottom electrode via contacts
US-10833257-B1 · Nov 10, 2020 · US
MRAM device formation with in-situ encapsulation
US-10833258-B1 · Nov 10, 2020 · US
Mram device formation with in-situ encapsulation
US-2020350495-A1 · Nov 5, 2020 · US
Formation of embedded magnetic random-access memory devices with multi-level bottom electrode via contacts
US-2020350494-A1 · Nov 5, 2020 · US
Alternating hardmasks for tight-pitch line formation
US-2020266066-A1 · Aug 20, 2020 · US
Multilayer hardmask for high performance MRAM devices
US-10714683-B2 · Jul 14, 2020 · US
Formation of embedded magnetic random-access memory devices
US-10707413-B1 · Jul 7, 2020 · US
Lithographic alignment of a conductive line to a via
US-10685879-B1 · Jun 16, 2020 · US
Multilayer hardmask for high performance MRAM devices
US-10680169-B2 · Jun 9, 2020 · US
Multilayer hardmask for high performance mram devices
US-2020144491-A1 · May 7, 2020 · US
Multi-layer encapsulation to enable endpoint-based process control for embedded memory fabrication
US-2020111951-A1 · Apr 9, 2020 · US
Alternating hardmasks for tight-pitch line formation
US-10580652-B2 · Mar 3, 2020 · US
Alternating hard mask for tight-pitch fin formation
US-2020066520-A1 · Feb 27, 2020 · US
Multilayer hardmask for high performance mram devices
US-2019386210-A1 · Dec 19, 2019 · US
Extreme ultraviolet lithography for high volume manufacture of a semiconductor device
US-2019348281-A1 · Nov 14, 2019 · US
Method of forming field effect transistor (fet) circuits, and forming integrated circuit (ic) chips with the fet circuits
US-2019164773-A1 · May 30, 2019 · US
Method of forming field effect transistor (FET) circuits, and forming integrated circuit (IC) chips with the FET circuits
US-10304692-B1 · May 28, 2019 · US
Rework of patterned dielectric and metal hardmask films
US-10242872-B2 · Mar 26, 2019 · US
Alternating hardmasks for tight-pitch line formation
US-2018350600-A1 · Dec 6, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 32 |
| Tessera Inc | 3 |
| Stmicroelectronic Inc | 1 |
| Globalfoundries Inc | 1 |
| Interational Business Machines Corp | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P76/4085 | 20 |
| H01L21/0337 | 17 |
| H10P50/73 | 13 |
| H10P76/405 | 13 |
| H01L21/0332 | 13 |