Microelectronic devices having air gap structures integrated with interconnect for reduced parasitic capacitances
US-2025079292-A1 · Mar 6, 2025 · US
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Patent family 62709911
This patent family groups 7 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 62709911 |
| Family type | — |
| Earliest priority | Dec 30, 2016 |
| First filing country | US |
| Member publications | 7 |
| Countries | US |
| Representative publication | US2025079292A1 — Microelectronic devices having air gap structures integrated with interconnect for reduced parasitic capacitances |
Representative publication
Best representative member for this family based on priority and filing country.
US2025079292A1 — Microelectronic devices having air gap structures integrated with interconnect for reduced parasitic capacitances (published Mar 6, 2025)
Member publications
Related publications in this family.
Microelectronic devices having air gap structures integrated with interconnect for reduced parasitic capacitances
US-12148690-B2 · Nov 19, 2024 · US
Microelectronic devices having air gap structures integrated with interconnect for reduced parasitic capacitances
US-2023207446-A1 · Jun 29, 2023 · US
Microelectronic devices having air gap structures integrated with interconnect for reduced parasitic capacitances
US-11587862-B2 · Feb 21, 2023 · US
Microelectronic devices having air gap structures integrated with interconnect for reduced parasitic capacitances
US-2021202374-A1 · Jul 1, 2021 · US
Microelectronic devices having air gap structures integrated with interconnect for reduced parasitic capacitances
US-10998260-B2 · May 4, 2021 · US
Microelectronic devices having air gap structures integrated with interconnect for reduced parasitic capacitances
US-2019304896-A1 · Oct 3, 2019 · US