Integrated circuit package substrate
US-10770387-B2 · Sep 8, 2020 · US
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Patent family 52828503
This patent family groups 8 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 52828503 |
| Family type | — |
| Earliest priority | Oct 16, 2013 |
| First filing country | US |
| Member publications | 8 |
| Countries | US |
| Representative publication | US10770387B2 — Integrated circuit package substrate |
Representative publication
Best representative member for this family based on priority and filing country.
US10770387B2 — Integrated circuit package substrate (published Sep 8, 2020)
Member publications
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