Through-substrate vias with improved connections
US-12387996-B2 · Aug 12, 2025 · US
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Patent family 44857604
This patent family groups 9 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 44857604 |
| Family type | — |
| Earliest priority | Apr 28, 2010 |
| First filing country | US |
| Member publications | 9 |
| Countries | US |
| Representative publication | US12387996B2 — Through-substrate vias with improved connections |
Representative publication
Best representative member for this family based on priority and filing country.
US12387996B2 — Through-substrate vias with improved connections (published Aug 12, 2025)
Member publications
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